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... Series is a thermosonic wire bonder engineered for high-throughput CMOS image sensor wire bonding. It delivers up to 30% higher UPH compared with typical Cu wire applications, ...
ASM Assembly Systems
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ASM Assembly Systems
... The newest Palomar fully automated, thermosonic high- speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles. Based on Palomar’s proven wire ...
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Kulicke & Soffa
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Kulicke & Soffa
... ConnX ELITE™ Opto is the latest high speed automatic wire bonder in the industry leading Power Series. Updated motion control systems and the Quick-LED Suite processes deliver maximum ...
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