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ATX single-board computer UP-TWL02N150-A10-0864
Intel® Processor N150Intel® Processor N-seriesIntel® Processor N250

ATX single-board computer - UP-TWL02N150-A10-0864 - AAEON - Intel® Processor N150 / Intel® Processor N-series / Intel® Processor N250
ATX single-board computer - UP-TWL02N150-A10-0864 - AAEON - Intel® Processor N150 / Intel® Processor N-series / Intel® Processor N250
ATX single-board computer - UP-TWL02N150-A10-0864 - AAEON - Intel® Processor N150 / Intel® Processor N-series / Intel® Processor N250 - image - 2
ATX single-board computer - UP-TWL02N150-A10-0864 - AAEON - Intel® Processor N150 / Intel® Processor N-series / Intel® Processor N250 - image - 3
ATX single-board computer - UP-TWL02N150-A10-0864 - AAEON - Intel® Processor N150 / Intel® Processor N-series / Intel® Processor N250 - image - 4
ATX single-board computer - UP-TWL02N150-A10-0864 - AAEON - Intel® Processor N150 / Intel® Processor N-series / Intel® Processor N250 - image - 5
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Characteristics

Form factor
ATX
Processor
Intel® Processor N150, Intel® Processor N-series, Intel® Processor N250
Extension slot
M.2, M.2 Key E
Operating system
Linux® Ubuntu™, Windows 10, Yocto, Windows 11
Connectivity
gigabit Ethernet, WiFi, USB 3.2, HDMI, RS-485, RS-422, RS-232
Applications
for industrial automation, for IoT applications
Data storage
eMMC 128GB
Memory
LPDDR5
Other characteristics
industrial, embedded, compact, Edge AI
Processor frequency

Min.: 0 GHz

Max.: 8 GHz

Memory size

Min.: 0 GB

Max.: 8 GB

Description

Overview
The UP TWLS is an ultra‑slim, Wi‑Fi ready single‑board computer (SBC) designed for wireless edge applications and space‑constrained embedded systems. It integrates Intel® N‑series (Twin Lake) processor options in a compact 85 mm x 56 mm form factor, and provides flexible industrial I/O and a wide operating temperature range for reliable edge deployment.

Key features
  • Intel® Processor N‑series (Twin Lake) options: Intel® Core™ 3 Processor N355, Intel® Processor N250, Intel® Processor N150
  • Onboard LPDDR5 memory, up to 8 GB
  • Onboard eMMC storage, up to 128 GB
  • 1 x Gigabit Ethernet (GbE)
  • 1 x HDMI 1.4b
  • 3 x USB 3.2 Type‑A
  • 1 x M.2 2230 E‑Key slot (for Wi‑Fi modules)
  • 10‑pin RS‑232/422/485 wafer for industrial serial communication
  • Configurable wafers offering I2C, SPI and 8‑bit GPIO
  • 12 V DC‑in, 5 A power input
  • TPM 2.0


Applications
Designed for wireless edge computing and IoT deployments such as smart sensors, data loggers, compact automation controllers, and edge AI nodes where a slim footprint, wireless capability and flexible I/O are required. Suitable for space‑constrained embedded systems in industrial and commercial environments.

Technical specifications
  • Model: UP TWLS
  • CPU: Intel® Processor N‑series (Twin Lake) — options include Core™ 3 N355, N250, N150
  • Form factor / Dimensions: Ultra‑slim SBC, 85 mm x 56 mm
  • Memory: Onboard LPDDR5, up to 8 GB
  • Storage: Onboard eMMC, up to 128 GB
  • Wireless: M.2 2230 E‑Key slot for Wi‑Fi module
  • Networking: 1 x Gigabit Ethernet (GbE)
  • Display: 1 x HDMI 1.4b
  • USB: 3 x USB 3.2 Type‑A
  • Expansion: M.2 2230 E‑Key x1
  • Serial / Industrial I/O: 10‑pin RS‑232/422/485 wafer
  • Configurable I/O: I2C, SPI, 8‑bit GPIO via configurable wafers
  • Security: TPM 2.0
  • Power input: 12 V DC‑in, 5 A
  • Operating temperature: -20 °C to 70 °C
  • Typical use cases: Edge AI, industrial IoT, wireless sensor nodes, compact automation controllers
  • Additional: Free Edge AI Toolkit available for accelerating AI projects on UP platforms (toolkit mention only, no links included)

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