OverviewThe UP TWLS is an ultra‑slim, Wi‑Fi ready single‑board computer (SBC) designed for wireless edge applications and space‑constrained embedded systems. It integrates Intel® N‑series (Twin Lake) processor options in a compact 85 mm x 56 mm form factor, and provides flexible industrial I/O and a wide operating temperature range for reliable edge deployment.
Key features- Intel® Processor N‑series (Twin Lake) options: Intel® Core™ 3 Processor N355, Intel® Processor N250, Intel® Processor N150
- Onboard LPDDR5 memory, up to 8 GB
- Onboard eMMC storage, up to 128 GB
- 1 x Gigabit Ethernet (GbE)
- 1 x HDMI 1.4b
- 3 x USB 3.2 Type‑A
- 1 x M.2 2230 E‑Key slot (for Wi‑Fi modules)
- 10‑pin RS‑232/422/485 wafer for industrial serial communication
- Configurable wafers offering I2C, SPI and 8‑bit GPIO
- 12 V DC‑in, 5 A power input
- TPM 2.0
ApplicationsDesigned for wireless edge computing and IoT deployments such as smart sensors, data loggers, compact automation controllers, and edge AI nodes where a slim footprint, wireless capability and flexible I/O are required. Suitable for space‑constrained embedded systems in industrial and commercial environments.
Technical specifications- Model: UP TWLS
- CPU: Intel® Processor N‑series (Twin Lake) — options include Core™ 3 N355, N250, N150
- Form factor / Dimensions: Ultra‑slim SBC, 85 mm x 56 mm
- Memory: Onboard LPDDR5, up to 8 GB
- Storage: Onboard eMMC, up to 128 GB
- Wireless: M.2 2230 E‑Key slot for Wi‑Fi module
- Networking: 1 x Gigabit Ethernet (GbE)
- Display: 1 x HDMI 1.4b
- USB: 3 x USB 3.2 Type‑A
- Expansion: M.2 2230 E‑Key x1
- Serial / Industrial I/O: 10‑pin RS‑232/422/485 wafer
- Configurable I/O: I2C, SPI, 8‑bit GPIO via configurable wafers
- Security: TPM 2.0
- Power input: 12 V DC‑in, 5 A
- Operating temperature: -20 °C to 70 °C
- Typical use cases: Edge AI, industrial IoT, wireless sensor nodes, compact automation controllers
- Additional: Free Edge AI Toolkit available for accelerating AI projects on UP platforms (toolkit mention only, no links included)