Product overviewThe BBPXST-RG is a multilayer piezoelectric ring actuator that generates axial micro-displacement when a drive voltage is applied. It uses alternating ceramic layers and internal electrodes with side termination connections. Typical applications include precision positioning, valves, micro‑pumps and vibration control in industrial and instrumentation systems.
Construction and options- Side termination electrodes connect internal electrodes; remaining surfaces are ceramic-insulated.
- A cross mark on the side identifies positive polarity to ensure correct electrical orientation during assembly.
- Dimensions and drive voltage can be customized; alternative lead types and encapsulation are available for special environments.
Available specificationsDrive voltage | Dimensions — Outer diameter × inner diameter × height | Capacitance ±15% | Frequency | Nominal displacement ±15% | Maximum generated force
150 V | 6.0 × 2.5 × 3.0 mm | 195 nF | 475 kHz | 2.7 µm | 930 N
150 V | 8.3 × 3.0 × 2.0 mm | 550 nF | 515 kHz | 2.6 µm | 1800 N
150 V | 15.0 × 9.0 × 3.2 mm | 2200 nF | 260 kHz | 3.9 µm | 4520 N
Use and selection- Each table row corresponds to one configuration. Select drive voltage, target displacement, operating frequency and required force together to match your application.
- Actual displacement depends on drive voltage, mechanical load and mounting conditions. Avoid impact, bending loads and concentrated stresses during assembly.
- For vacuum, high‑temperature or corrosive environments, confirm lead type, bonding method and encapsulation compatibility before selection.
Technical specifications- Model: BBPXST-RG
- Operating principle: Alternating ceramic layers with internal electrodes produce axial micro-displacement under applied drive voltage
- Side termination: Side termination electrodes connect internal electrodes; other sides insulated
- Polarity identification: Cross mark on the side indicates positive polarity
- Customization: Dimensions and drive voltage can be customized; options for leads and encapsulation available
- Example configurations: 150 V — 6.0 × 2.5 × 3.0 mm — 195 nF — 475 kHz — 2.7 µm — 930 N; 150 V — 8.3 × 3.0 × 2.0 mm — 550 nF — 515 kHz — 2.6 µm — 1800 N; 150 V — 15.0 × 9.0 × 3.2 mm — 2200 nF — 260 kHz — 3.9 µm — 4520 N