Linear piezoelectric actuator BBPXMS-DC

101 V...300 Vfor industrial applicationsceramic

Product overview
BBPXMS-DC is a disc multilayer piezoelectric stack actuator designed to produce controlled axial micromovement for precision industrial applications. Multilayer ceramic chips are stacked axially and bonded to deliver high output force in a short stroke.

Construction and options

• Ceramic side insulation and Kapton® tape wrapping; standard leads are approximately 75 mm long.
• Ceramic end caps available in flat or hemispherical forms. Dimensions, drive voltage and surface coating can be customized on request.

Available specifications

• 200 V | Ø5.0 × 9.0 mm | 570 nF | 135 kHz | 11 µm | 780 N
• 200 V | Ø8.3 × 9.0 mm | 2200 nF | 355 kHz | 12 µm | 1800 N

Use and selection

• Select configurations by considering drive voltage, nominal displacement, operating frequency and required output force.
• Actual displacement depends on drive voltage, preload, mechanical load and mounting. Avoid impact, bending and concentrated stresses during assembly.
• For vacuum or aggressive environments, verify suitability of leads, bonding and encapsulation; special treatments may be required.
• Apply loads coaxially; avoid eccentric loading and shear forces. Match end cap geometry to the contact arrangement.

Technical specifications

• Model: BBPXMS-DC
• Product type: Disc multilayer piezoelectric stack actuator (axial micromovement)
• Construction: Axially stacked multilayer ceramic chips bonded with epoxy
• Insulation: Ceramic side insulation, Kapton® tape wrapping
• Standard leads: ~75 mm length
• End caps: Flat or hemispherical
• Customization: Dimensions, drive voltage, surface coating
• Available configurations: 200 V; Ø5.0 × 9.0 mm (570 nF, 135 kHz, 11 µm, 780 N); Ø8.3 × 9.0 mm (2200 nF, 355 kHz, 12 µm, 1800 N)
• Handling: Apply axial loads; avoid eccentric and shear forces; confirm compatibility for vacuum or special environments