Product overviewBBPXMS-RG uses multilayer ceramic chips stacked axially and bonded with epoxy to produce axial micromovement.
Construction and options- Ceramic side insulation and Kapton® tape wrapping; standard leads are approximately 75 mm long.
- Ceramic end caps are available in flat or hemispherical forms.
- Dimensions, drive voltage and surface coating can be customized.
Available specifications- 150 V — 6.0 × 2.5 × 13.0 mm — 725 nF — 100 kHz — Nominal displacement 9.5 µm — Max generated force 930 N
- 150 V — 8.3 × 3.0 × 9.0 mm — 2000 nF — 127 kHz — Nominal displacement 9.0 µm — Max generated force 1800 N
- 150 V — 15.0 × 9.0 × 13.5 mm — 8400 nF — 70 kHz — Nominal displacement 15 µm — Max generated force 4520 N
Use and selection- Each row represents one configuration. Select voltage, displacement, frequency and force together.
- Actual displacement depends on drive voltage, load and mounting. Avoid impact, bending and concentrated stress during assembly.
- For vacuum or special environments, confirm the suitability of leads, bonding and encapsulation.
- Apply loads along the axis, avoiding eccentric loads and shear forces. Match the end cap to the contact arrangement.
Technical specifications- Model: BBPXMS-RG
- Construction: Multilayer ceramic chips stacked axially, bonded with epoxy
- Insulation/wrapping: Ceramic side insulation; Kapton® tape wrapping
- Standard lead length: Approximately 75 mm
- End cap options: Flat or hemispherical ceramic end caps
- Customization: Dimensions, drive voltage and surface coating customizable
- Available configurations:
- 150 V — 6.0 × 2.5 × 13.0 mm — 725 nF — 100 kHz — Nominal displacement 9.5 µm — Max generated force 930 N
- 150 V — 8.3 × 3.0 × 9.0 mm — 2000 nF — 127 kHz — Nominal displacement 9.0 µm — Max generated force 1800 N
- 150 V — 15.0 × 9.0 × 13.5 mm — 8400 nF — 70 kHz — Nominal displacement 15 µm — Max generated force 4520 N
- Selection notes: Specify dimensions, drive voltage, target displacement, load, operating frequency, mounting and environment when ordering