Assembly unit XPO OverPass™

Overview
The Amphenol XPO OverPass™ cable assembly is engineered to maximize the performance of next-generation 12.8 Tb/s XPO-LPO optical pluggable transceivers. It consolidates 64 high-speed lanes into a compact front I/O footprint, providing four times the front-panel density of traditional OSFP solutions while enabling flexible routing to chips (NPC/CPC) or to backplane connectors. Available with 30 AWG or 32 AWG OverPass™ cable assemblies and lengths from 200 mm to 2000 mm, the product is optimized for demanding hyperscale and AI data center environments.

Application & System Compatibility
Designed for Open Compute Project (OCP) architectures and next-generation AI/HPC clusters. Supports front I/O density up to 204.8 Tb/s per OCP rack. Compatible with Amphenol backplane connector families including UltraPass™, UltraPass™ XR, UltraPass™ HD, XtremePass™, and Paladin® HD2, enabling flexible system integration in high-density platforms.

Key points

• Optimizes use of 12.8 Tb/s XPO-LPO optical pluggable transceivers
• Routes 64 high-speed lanes directly to chip (NPC/CPC) or to backplane
• Routing flexibility via 30 AWG or 32 AWG OverPass™ cable options
• Enables front I/O density up to 204.8 Tb/s per OCP rack (4× OSFP)

FEATURES / BENEFITS (table)

• Provides the mating interface to XPO pluggable transceiver | Maximizes value of 12.8 Tb/s XPO-LPO pluggable transceiver
• OverPass™ terminations to UltraPass™, UltraPass™ HD, UltraPass™ XR™, XtremePass™ or Paladin® HD2 backplane connectors | Reliable connection from XPO-LPO transceiver to chip (NPC/CPC) or backplane
• 30 AWG or 32 AWG cable options, lengths 200 mm to 2000 mm | Routing flexibility to meet application layout requirements
• Packs 64 high-speed lanes into a compact 1 OU package | Enables front I/O density to 204.8 Tb/s per OCP rack (4× OSFP)

Target markets & typical applications

• High Performance Computing (HPC)
• Data centers and hyperscale infrastructure
• Artificial Intelligence (AI) clusters

Technical specifications

• Connects 128 differential pairs to XPO-LPO optical transceiver
• Designed for 12.8 Tb/s XPO-LPO optical pluggable transceivers
• Routes 64 high-speed lanes to chip (NPC/CPC) or to backplane
• Wire options: 30 AWG or 32 AWG OverPass™ cable assemblies
• Available cable lengths: 200 mm to 2000 mm
• Front I/O density support: up to 204.8 Tb/s per OCP rack
• Compatible with backplane connectors: UltraPass™, UltraPass™ XR, UltraPass™ HD, XtremePass™, Paladin® HD2
• Packs 64 high-speed lanes into a compact 1 OU package
• Engineered for OCP architectures, AI/HPC and cloud data center infrastructure