Electrical power supply connector CoolPower® HDF

board-to-boardparallelright-angle

Amphenol's CoolPower® HDF Connector Series is a high-density pin and socket connector solution engineered to maximize power delivery in low-profile system architecture. With low-profile stack heights from 2.0 mm to 10.0 mm, the CoolPower® HDF series is an ideal solution for space-constrained applications while maximizing power output delivery. The CoolPower® HDF family supports an array of pin diameters including, 3.2 mm, 6.0 mm, 8.0 mm, and 11.00 mm, while offering high-density current-carrying capabilities from 75 A to 350 A per pin, making it an ideal high-current connector for demanding applications. CoolPower® HDF offers an industry-leading radial self-alignment up to ± 1.00 mm, with floating capability to minimize potential damage to the connectors and specifically to the socket's contact beams during mating. Its versatile design options offer vertical and right-angle sockets and permit parallel, right-angle, co-planar, offset-planar, and reverse planar mating configurations. With screw-mounted, surface-mounted, press-fit, and threaded pin and sockets, CoolPower® HDF adapts to various board-to-board, board-to-busbar, and busbar-to-busbar applications. This versatility and compact form factor make it an ideal high-density power connector for power-dense data center, energy storage and next-gen platforms. Extensive range of pin diameters from 3.40 mm to 11.00 mm High current carrying capability of 75 A to 350 A, based on pin diameter size Low profile configuration with stack heights from 2.0 mm to 10.00 mm ± 1.00 mm radial self-alignment to relieve tolerance stack-up Versatile configurations permit numerous mating styles