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Data connector CompacLink™
board-to-boardlow-profilehigh-speed

Data connector - CompacLink™ - FCI - board-to-board / low-profile / high-speed
Data connector - CompacLink™ - FCI - board-to-board / low-profile / high-speed
Data connector - CompacLink™ - FCI - board-to-board / low-profile / high-speed - image - 2
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Characteristics

Type
data
Format
board-to-board
Shape
low-profile
Electrical characteristics
high-speed
Domain
for data transmission, for telecom applications, for the electronics industry
Other characteristics
high-performance, high-speed
Voltage

500 V

Pitch

0.6 mm
(0.024 in)

Operating temperature

Max.: 105 °C
(221 °F)

Min.: -40 °C
(-40 °F)

Description

Product
  • Product series: CompacLink LP PCIe Gen5 Compression BTB
  • Brand: Amphenol Commercial Solutions


Overview
  • Type: compression board-to-board connector for PCIe Gen5 signal transmission
  • Function: enables high-density, high-speed PCB interconnection


Key technical points
  • Series name: CompacLink LP
  • Application: designed for PCI Express Gen5 systems
  • Contact system: compression BTB contact intended for controlled mating and signal integrity


Applications
  • Server, data center and networking equipment
  • High-speed storage and compute modules


Ordering information
  • For part numbers, configurations and datasheets, contact Amphenol Commercial Solutions

Catalogs

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