The Paladin® HD interconnect system provides world-class bandwidth from 112 Gb/s to 224 Gb/s with industry-leading density, supporting up to 144 differential pairs orthogonally within 1 RU spacing. Paladin® HD utilizes a balanced pair structure, built with individually assembled and discretely shielded differential pairs with a revolutionary hybrid board attachment for maximized density and electrical performance. Paladin® HD supports all system architectures, including backplane, orthogonal, board-to-cable, and cable-to-cable topologies. Paladin® HD's unique mating interface allows for consistent performance in a de-mated condition, critical for next-generation systems.
Industry-leading SI performance supporting 224 Gb/s data rates
Supports a wide range of applications supporting wire sizes up to 26 AWG for maximum performance and as small as 32 AWG to maximize density
Exceptional density to maximize signal count and minimize air flow restrictions
Impedance control over 1.00 mm connector de-mate
Backwards compatible with Paladin® HD for a direct upgrade path
FEATURES
World class SI performance at 224 Gb/s
Industry leading density at 224 Gb/s
All system architectures supported; cables can attach to other 224 Gb/s interfaces
Symmetrical mating interface
Mechanically matched and electrically balanced signals within each differential pair
Unique 45° differential pair interface
Linear transmission through 67 GHz
Mate compatible with Paladin® HD
BENEFITS
Maximize channel performance and cable reach for high-performing and dense applications
144 differential pairs within 1RU rack spacing orthogonally, with room for airflow