Sub-micron die bonder FINEPLACER® lambda

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Flexible Sub-micron Die Bonder The flexible FINEPLACER® lambda is a sub-micron die-bonder for precision die attach and advanced chip packaging. It offers a modular design and can be easily reconfigured for future applications, making it the premier choice when maximum technological versatility and fast process implementation is key. Typical fields of application include R&D, universities, prototyping and low-volume production. The system handles a wide range of applications, including laser bar and diode bonding with Indium or Au/Sn, VCSEL/photo diode bonding (glueing, curing) and the multi-stage assembly of opto electro mechanical systems (i.e. MEMS/MOEMS) for communications and medical technology products. Highlights - Sub-micron placement accuracy - Unique optical resolution - Handles ultra small components with special tooling - Closed loop force control - Small footprint and compact design - Optics movement with programmable positions