Ultrasonic welding machine T9000

automaticfor electronic componentsfor automotive parts

Product overview
The T9000 series fully automatic ultrasonic coarse-aluminum wire bonder delivers a stable and efficient bonding solution for power semiconductor devices. It is suitable for various power modules (IGBT modules, SiC modules, industrial IGBT modules) and is widely used in power electronics, automotive electronics, consumer electronics and new energy sectors.

Product features

• Stable and reliable: Robust marble motion platform reduces equipment vibration during bonding and ensures long-term positional accuracy. Y-axis gantry with dual-motor control provides high synchronization for large-travel linear motion.
• High productivity: Generously sized bonding area reduces fixture changes and PR time to increase throughput; direct-drive motion system enables fast motion response.
• Quality monitoring: Comprehensive bonding quality monitoring system outputs real-time statistical curves and tracks parameters such as wire deformation, ultrasonic frequency and ultrasonic energy; sensitive wire-feed monitoring supports line-change pre-alerts and bonding anomaly alarms.
• Easy operation: Graphical bonding-head assistance simplifies head installation, clip handling and wedge replacement; online force calibration eliminates the need for external balances; clear graphical HMI improves operator efficiency.
• Flexible integration: Large side windows simplify integration with various load/unload systems; configurable SECS-GEM and PLC communication protocols enable factory automation integration.

Technical specifications

• Model: T9000
• Applicable devices: IGBT modules, SiC modules, industrial IGBT modules and other power semiconductor devices
• Applicable industries: Power electronics, automotive electronics, consumer electronics, new energy
• Mechanical structure: Marble motion platform; Y-axis gantry dual-motor control; direct-drive motion system
• Bonding capability: Large bonding area; supports ultrasonic coarse-aluminum wire bonding
• Recognition & positioning: High-compatibility pattern recognition (PR) capability
• Quality monitoring parameters: Wire deformation, ultrasonic frequency, ultrasonic energy, real-time statistical curve output; wire-feed monitoring and line-change pre-alert; bonding anomaly alarm
• Operation & maintenance: Graphical bonding-head installation assistance; online force calibration; user-friendly HMI
• Communications & integration: Configurable SECS-GEM and PLC interfaces for integration with load/unload and factory automation systems
• Documentation: Product datasheet (PDF) available for download