Aging test system MX300R

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Product overview
MX300R series high-temperature reverse-bias voltage stress aging test system is a high-temperature voltage-stress aging test solution. It integrates a heating unit, temperature-control unit, high/low voltage sources and control & data acquisition units. It is designed to perform voltage-stress aging tests on power devices (IGBT, SiC, MOSFET, diode) to evaluate device reliability under high-temperature voltage stress.

Key features

• High measurement accuracy: automatic current-range selection based on measured leakage to ensure precise readings;
• Real-time monitoring and recording: continuous capture of test temperature, per-channel voltage and leakage current with complete trend curves;
• Independent high-voltage breakdown protection: per-station series protection devices to prevent test-board damage from device failures;
• Wide device compatibility: supports Si/SiC/GaN power devices, including discrete dies and module packages (IGBT, MOSFET, DIODE).

Specifications / Technical data

• Model: MX300R
• Test type: high-temperature voltage-stress aging (reverse-bias)
• Main components: heating unit, temperature controller, high/low voltage sources, control and acquisition unit
• Applicable devices: IGBT, SiC, MOSFET, DIODE (discrete and module packages)
• Protection: independent high-voltage breakdown protection and per-station series protection devices
• Data acquisition: real-time monitoring of temperature, per-channel voltage and leakage current with full trend recording
• Measurement accuracy: automatic current-ranging according to actual leakage to maintain precision
• Note: page does not provide EAN, price or a full textual specification sheet (some specs shown as images)