Automatic gluing machine M6000

ultrasonicmanual

Product overview The M6000 ultrasonic wire bonder is a manual bonding system engineered to create electrical interconnections between chips and substrates and to enable inter‑chip communication. Based on ultrasonic bonding principles, the unit integrates precision mechanical design with advanced hardware and software control to form reliable metallic lead bonds to substrate pads. It is intended for semiconductor device laboratory R&D, prototype runs, evaluation and repair.

Specifications sheet The product page contains images illustrating the product specifications and parameters.

Key features

• High‑end grating sensor providing high‑precision closed‑loop force control to improve bonding accuracy;
• DSP phase‑locked technology delivering stable ultrasonic energy output to ensure consistent bond quality;
• XYZ three‑axis electric locking for stable, serviceable clamping operation;
• Parallel quadrilateral bonder head with dock‑fed wire delivery for capability to bond deep‑cavity devices;
• Advanced force control algorithms that mitigate motor jitter and missed steps, producing highly consistent tail shapes;
• Process‑oriented mechanical architecture adaptable to complex bonding conditions;
• Industrial‑grade touchscreen with programmable software interface for user‑friendly HMI.

Clamping stage The product page includes illustrations of the clamping stage.

Options and peripherals Detailed textual descriptions of optional functions and peripherals are not provided on the page.

Characteristics / Technical specifications

• Model: M6000
• Bonding principle: Ultrasonic bonding
• Application: Semiconductor device laboratory R&D, prototype production, evaluation, repair
• Control: Integrated hardware and software control system with DSP phase‑lock technology
• Positioning / clamping: XYZ three‑axis electric locking with grating sensor closed‑loop force control
• Structure: Parallel quadrilateral bonder head, supports deep‑cavity device bonding
• HMI: Industrial‑grade touchscreen with programmable software interface