Performance test system MX700KGD-600

for IGBTon siteautomatic

Product introduction
MX700KGD series chip dynamic/static screening test system is an automated solution for screening bare dies, primarily used for SiC MOS and IGBT chips. The system consists of the test mainframe, automation equipment and probe card assembly, and measures nominal current and voltage to evaluate die electrical performance and integrity.

Operation
The test-station lift mechanism raises the die carrier until the probe card contacts the die. The probe card features a sealed pressure chamber and provides automatic die height calibration to ensure stable contact.

Specification sheet
Dynamic test technical parameters
Static test technical parameters

Features

• Comprehensive test coverage with configurable functions per customer requirements, including visual inspection and dynamic/static testing at high or ambient temperatures;
• High-voltage, high-current capability to perform nominal-spec testing on bare dies;
• Low parasitics: system parasitic inductance less than 20 nH;
• High throughput: test UPH up to 600 pieces or more;
• Gas protection to prevent arcing and oxidation during testing.

Characteristics / Technical details

• Applicable devices: dynamic/static screening for power dies such as SiC MOS and IGBT;
• System composition: test mainframe, automation equipment (die carrier, lift mechanism), and probe card assembly;
• Test capability: measurement of nominal current and nominal voltage and pass/fail screening;
• Lift and contact: test-station lift drives die carrier until probe contact; probe card pressure chamber ensures sealed, stable contact;
• Auto calibration: automatic die height calibration function;
• Electrical characteristics: supports high-voltage, high-current tests to meet bare-die nominal specifications;
• Parasitic parameters: system parasitic inductance < 20 nH;
• Throughput: test UPH ≥600 pcs/hour;
• Protection: gas shielding to prevent arcing and oxidation during testing;
• Configurability: test functions and configuration customizable per customer, supporting visual inspection and dynamic/static tests at different temperatures.