Automatic sample preparation system IM5000

for SEMion beam millingcooling

Overview
The Hitachi IM4000II and IM5000 ion milling systems deliver precision sample preparation for scanning electron microscopy (SEM) and related surface-analysis techniques. Suitable for metals, semiconductors, polymers, ceramics and multilayer materials, these systems produce high-quality cross-sections and flat-polished surfaces with minimal artifacts. Built for research labs, industrial quality control and materials science workflows, both models provide reproducible, high-throughput results for advanced electron microscopy applications.

Key features

• High milling rate: fast material removal for hard substrates.
• Cross-section & flat milling modes: flexible processing for diverse sample types.
• Cryogenic cooling (optional): protects temperature-sensitive materials.
• User-friendly interface: intuitive touch-screen controls and programmable cycles.
• SEM/AFM compatibility: integration with Hitachi and third-party microscopes; Air protection Holder Unit available.

Features and benefits

• Throughput: IM4000II ≈ 500 μm/h (Si, 100 μm protrusion); IM5000 ≥ 1 mm/h (same condition) to reduce sample turnaround time.
• Mode versatility: cross-section milling yields smooth, undistorted interfaces; flat milling removes surface-layer artifacts benefiting EBSD and high-contrast imaging.
• Wide-area cross-section (IM5000): enables uniform milling up to 10 mm width for large electronic components and industrial samples.
• Cryogenic option: Cooling Temperature Control (0°C to −100°C via LN2) preserves polymers, biologicals and other heat-sensitive specimens.
• Beam control: programmable intermittent irradiation (ON/OFF cycles) and adjustable accelerating voltage for beam-sensitive materials.
• Workflow integration: compatible with Hitachi SEMs and third-party systems; optional holders and masks for inert transfers and extended beam tolerance.

Applications

• Metals & alloys — microstructure and cross-sectional analysis.
• Batteries — electrode and layered cell cross-sections.
• Electronics & semiconductors — layer exposure in ICs and devices.
• Polymers & soft materials — cryo-cooled preparation to prevent deformation.
• Multilayer films & coatings — layer composition and adhesion studies.
• Hard industrial materials — sample prep for SEM and surface analysis.

Specifications (summary)
Gas used : Ar (argon)
Accelerating voltage : IM4000II 0–6 kV | IM5000 0–8 kV
Maximum milling rate (Si, 100 μm protrusion) : IM4000II ≈ 500 μm/h | IM5000 ≥ 1 mm/h
Maximum milling width : IM4000II not available | IM5000 up to 10 mm
Maximum specimen size : 20 mm (W) × 12 mm (D) × 8 mm (H)
Sample moving range : X ±7 mm, Y 0 to +3 mm
Ion beam intermittent irradiation : programmable ON/OFF (1 s to 59 min 59 s)
Swing angle : ±15°, ±30°, ±40°
Flat milling area : φ 32 mm; maximum flat-milled sample size φ 50 × 25 mm (H)
Rotation speed : 1 rpm, 25 rpm
Tilt range : 0° to 90°
Cooling temperature control (optional) : 0°C to −100°C via LN2

Technical specifications

• Gas: Argon (Ar).
• Acceleration voltage: IM4000II 0–6 kV; IM5000 0–8 kV.
• Milling rate: IM4000II ≈ 500 μm/h; IM5000 ≥ 1 mm/h (Si, 100 μm protrusion).
• Wide-area cross-section: IM5000 up to 10 mm; IM4000II not available.
• Maximum specimen size and flat milling dimensions as listed above.
• Programmable intermittent irradiation and adjustable beam parameters for beam-sensitive materials.
• Optional modules: Cooling Temperature Control, higher beam-tolerance masks, stereo microscope unit (15×–100×), Air protection Holder Unit and mounting accessories.