Wire EDM electrical discharge machine U32j

for mold manufacturingprecisionhigh-accuracy

Overview
The U32j Wire EDM machine is built to achieve higher levels of precision and surface finish capability over standard U3 and U3 H.E.A.T. models. It can produce surface finishes down to 0.07 µm Ra (34 µin Ra) with the Crystal II Circuit and can optionally operate with wire sizes down to 50 µm (0.002"). The U32j is well suited for high-precision plastic injection molds, precision stamping tools, and medical component applications.

Design and Accuracy
Uses a stationary work table configuration to improve accuracy and eliminate the positional variations associated with traveling-table designs. Improved positional accuracy is achieved through higher tolerance alignment during assembly with axis accuracies of 3 µm (0.0001") straightness and 4 µm (0.00015") squareness and parallelism. The integrated dielectric reservoir in the base casting reduces footprint and improves thermal stability. Chilled air circulation around the U/V/Z axes helps maintain consistent machine temperature for sustained precision.

Operation & Control
Includes Makino’s Hyper i control featuring a straightforward 3-step operation process (Program / Setup / Run). The control provides a large 24" class HD touchscreen with intuitive pinch/swipe/drag operation. Standard control features include a full-function advanced Handbox, digital onboard electronic manuals, instructional training videos, and E-Tech Doctor help functions to support operator productivity.

Ergonomics & Automation
A programmable rise & fall 3-sided work tank provides excellent ergonomic access to the work zone and simplifies loading and setup. The rise & fall work tank also offers unimpeded access for maintenance and an automation-ready configuration for streamlined integration. Optional features include Makino H.E.A.T. technology to boost productivity in poor flush applications and an available 3D probe system to reduce setup time.

Key Features (high level)

• Surface finish capability down to 0.07 µm Ra (34 µin Ra) with Crystal II Circuit
• Optional wire sizes down to 50 µm (0.002")
• Stationary work table for improved accuracy
• Integrated dielectric reservoir for reduced footprint and better thermal stability
• Chilled air circulation for temperature stability around axes
• Programmable rise & fall 3-sided work tank for ergonomics and automation readiness
• Hyper i control with 24" HD touchscreen, Handbox, electronic manuals and training videos
• Optional H.E.A.T. technology and 3D probe system

Technical specifications

• Model: U32j
• Table (metric): 780 x 590 mm; Travel X: 370 mm, Y: 270 mm, Z: 220 mm
• Maximum Workpiece Size (imperial): 30.7 x 23.2 x 8.7 "
• Maximum Workpiece Weight (imperial): 1,322 lbs
• Tank Size (metric): 790 x 610 mm
• Tank Size (imperial): 31.1 x 24.0 "
• Available Wire Size (metric listed on site): 0.08, 0.10, 0.15, 0.20, 0.25, 0.30 mm
• Available Wire Size (imperial listed on site): 0.003, 0.004, 0.006, 0.008, 0.010 & 0.012 "
• Positional accuracy: 3 µm straightness; 4 µm squareness and parallelism
• Surface finish capability: down to 0.07 µm Ra (34 µin Ra)
• Minimum optional wire: down to 50 µm (0.002")
• Control: Hyper i control with 24" class HD touchscreen and advanced Handbox
• Optional: H.E.A.T. technology, 3D Probe, automation-ready configuration