Multitouch screen panel PC R15ITWS-MHC3

PCAP touchscreen15"Intel® Core™ i5-1135G7

Product
The R15ITWS-MHC3 is a 15-inch M Series HMI panel PC with Intel® Core™ i5-1135G7 (Tiger Lake UP3), designed for machine control, factory automation and operator HMI applications. It features a true flat edge-to-edge projected capacitive multi-touch (PCAP) display, aluminum corrosion-protected housing, front IP65 sealing and a fanless architecture for deployment in industrial environments.

Key features

• Intel® 11th Gen Tiger Lake UP3 Core™ i5 (i5-1135G7)
• True flat edge-to-edge PCAP multi-touch display
• Aluminum housing with anti-corrosion treatment
• Front IP65 protection against dust and water
• Fanless design
• Wide DC input range 9–29 V
• Removable 2.5” SSD bay and M.2 NVMe storage options
• Modular BoxPC and Display architecture for field servicing

Overview / Design highlights

• Modular design: interchangeable Box PC and Display modules connected via board-to-board docking for flexible maintenance and configuration changes.
• PCAP multi-touch: supports simultaneous multi-touch; touch sensor installed behind glass or vandal-resistant glass for scratch and cleaner resistance.
• Serviceability: accessible service window for memory upgrades, drive replacement and PCIe module access.
• Front IP65 & true flat: sealed front and flat surface simplify cleaning and enable outdoor kiosk use.

Certifications
CE, FCC

Notes
Designed for industrial and embedded OEM applications requiring modularity, long lifecycle supply and field serviceability.

Technical specifications

• Display: 15.0 inches, 1024 x 768, 300 nits, 2000:1 contrast, active area 304.1 x 228.1 mm, view angles 88/88/88/88
• Touch / Glass: Projected Capacitive Multi Touch (PCAP), true flat
• Processor: Intel Core i5-1135G7 2.4 GHz (up to 4.2 GHz)
• Memory: 2x slots, default 4 GB, optional 8/16/32 GB
• Storage: 1 x M.2 2280 NVMe (128–512 GB default options); optional 2 x 2.5" removable SSD bay (256–512 GB)
• Ethernet: Intel® I211-AT and Intel® I219-LM
• Security: TPM 2.0
• OS (optional): Windows 11 IoT Enterprise 64-bit; Windows 11 Pro 64-bit; Linux Ubuntu 22.04 (Wake on Touch not supported)
• Wireless: optional WLAN / Bluetooth (M.2 2230 Key E for WiFi)
• Expansion: 1 x mPCIe slot; 1 x PCIe x16 (x4 signal, module max 180 x 121 mm); M.2 2280 Key M for NVMe; swappable 2.5" bay
• IO ports: 4 x USB 3.2 Gen1 Type-A; 2 x RS232/422/485 (default RS232); 2 x Gigabit LAN RJ45; 1 x DP 1.4 (default); 1 x HDMI 2.0 (optional); 1 x audio combo
• Mechanical: 367 x 291 x 91 mm; cut-out 342 x 261 mm; weight 6.6 kg; panel mount (default), VESA optional
• Power: 1 x 9–29 V DC terminal block; adapter 12 V 120 W (typical); consumption ~45–55 W; fused protection
• Environment: operating 0°C to 50°C; storage -10°C to 60°C; humidity 10%–90% RH non-condensing
• IP rating: Front IP65
• Certifications: CE, FCC
• Accessories: 100–240 V AC/DC adapter, power cord, open wire cable with terminal block, mounting clips, VESA screws (depending on configuration)