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Working temperature: -73 °C - 204 °C
Polymerization time: 1 h - 6 h
... conductivity: 41.6–45.1 BTU·in/(ft²·hr·°F) [6.0–6.5 W/(m·K)]
Product Description
EP54TC is a
thermally
conductive, electrically insulating two-part epoxy with a 100:5 mix ratio by weight and ...
Master Bond
... Key Features • Room temperature curing • Low shrinkage upon cure • Very low coefficient of thermal expansion • Superior dimensional stability • Passes fungus resistance MIL-STD-810G • Withstands 1,000 hours 85°C/85% RH Master Bond EP30LTE-LO ...
Master Bond
... temperature resistant • Thermally conductive • Tough and flexible • Easy to apply and doesn’t require freezing • Excellent electrical insulation properties • Uniform bond line thickness Master Bond FLM36 is a ...
Master Bond
... prominent use is as a glob top material, it also can be utilized as a die attach, potting and coating system. Because it is thermally conductive, it transfers heat efficiently. This epoxy passes NASA low outgassing test ...
Master Bond
... Two part, room temperature curing, thermally conductive silicone with ultra fine particle filler for bonding and smaller gap filling Key Features * High thermal conductivity * Very good electrical insulator * Low ...
Master Bond
... Key Features - Available in 30 gram preforms - High temperature resistant - Thermally conductive & electrically insulative - Flexibilized and toughened - Unlimited working life at room temperature - Meets NASA low ...
Master Bond
... type situations and other applications where that requirement is needed. EP17HTDA-1 is used primarily as a die attach and adhesive/sealant in electronic and related applications, where high temperature resistance, good electrical insulation ...
Master Bond
Working temperature: -80 °F - 400 °F
Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an outstanding thermal conductivity of 16-17 W/(m·K). It cures rapidly at temperatures of around 250-300°F [~ 125-150°C], and has an unlimited working life at room temperature. ...
Master Bond
... color. As mentioned above, this multifaceted system can be used as a glob top or die attach and in other applications as an adhesive or sealant in electronics when the special combination of properties, particularly the limited flow characteristics ...
Master Bond
... Master Bond EP21TCHT-1 is a two component, thermally conductive, heat resistant epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures. EP21TCHT-1 has a 100:60 mix ratio by ...
Master Bond