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Memory size: 0 GB - 32 GB
... and requires a compatible carrier board for full I/O access. Target applications include industrial
edge computing, HMI, vision and
AI inference at the
edge.
Technical specifications
- Description:
SECO
Memory size: 0 GB - 32 GB
... basic module SOM-COMe-BT6-RK3588 integrating Rockchip RK3588 SoC and an on-board Axelera Metis AIPU (up to 120 TOPS) for
edge
AI, multimedia and industrial embedded applications.
Highlights
- CPU:
SECO
Memory size: 0 GB - 64 GB
... Qualcomm Dragonwing IQ‑X Series processors in SiP‑A, featuring a Qualcomm Hexagon NPU up to 45 TOPS. Designed for embedded and
edge
AI applications requiring high CPU/GPU performance and neural processing acceleration.
Highlights
- CPU
SECO
Memory size: 0 GB - 96 GB
... featuring AMD Ryzen™
AI Embedded P100 Series processors. Compact 95 x 95 mm module designed for embedded applications requiring
AI acceleration, multimedia and extensive I/O options.
Highlights
- CPU
SECO
Memory size: 0 GB - 96 GB
... featuring Intel® Core™ Ultra Series 3 processors (codename: Panther Lake-H), designed for high-performance embedded and
edge systems requiring
AI acceleration, multi-display support and extensive I/O.
Highlights
- CPU:
SECO
Memory size: 0 GB - 96 GB
... 3 processors (codename: Panther Lake-H). Designed for embedded systems requiring high compute, integrated graphics, on-board
AI acceleration and broad I/O options.
Highlights
- CPU: Intel® Core™ Ultra Series
SECO