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Edge computing computer-on-modules
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Memory size: 8, 16 GB
... Intel® Atom® Processor Amston Lake Series Dual Channel LPDDR5 4800MHz up to 16GB 1 LVDS/eDP, 1 DDI (HDMI/DP++);Supports dual displays: DDI + LVDS/eDP Multiple expansions: 4 PCIe x1, 1 SMBus, 1 I2C, 1 eMMC Rich I/O: 2 USB 3.1, 8 USB 2.0 High Speed ...
SMARC® Rel. 2.1.1 computer-on-moduleSOM-SMARC-QCS6490
Memory size: 0 GB - 12 GB
... SMARC® 2.1.1 module powered by Qualcomm® QCS6490 processor Video Resolution - Primary display: FHD+ @120 fps Secondary display: up to 4k Ultra HD @60Hz Audio 2x I2S Serial Ports 2x UART (RX/TX/RTS/CTS), 2x UART (RX/TX) Other Interfaces 2C Ultra ...
SECO
Memory size: 12 GB
... SMARC® 2.1.1 module with Qualcomm® QCS5430 processor Cpu 2x Arm® Cortex®-A78 @2.4 GHz, 4x Arm® Cortex®-A55 Memory Soldered-down LPDDR5-6400 memory, up to 12GB total, 32-bit interface 2 channels Graphics Qualcomm® Adreno™ 642L Video Interfaces LVDS ...
SECO
Memory size: 0 GB - 32 GB
... Overview
SMARC® Rel. 2.1.1 module for edge and embedded applications equipped with Qualcomm® Dragonwing™ IQ8 application processors. Designed for integration on a SMARC carrier board for industrial and commercial use.
Highlights
- CPU
SECO
SMARC 2.1 computer-on-moduleSOM-SMARC-TWL
Memory size: 0 GB - 16 GB
... Overview
SMARC® Rel. 2.1 module (E08) featuring Intel® Core™ i3 and Intel® Processors N Series (codename Twin Lake). Compact 50 x 82 mm form factor tailored for industrial embedded applications; LPDDR5 soldered memory and broad I/O options.
Highlights
- CPU
SECO
Memory size: 0 GB - 32 GB
... Overview
COM Express® Type 6 basic module SOM-COMe-BT6-RK3588 integrating Rockchip RK3588 SoC and an on-board Axelera Metis AIPU (up to 120 TOPS) for edge AI, multimedia and industrial embedded applications.
Highlights
- CPU:
SECO
Memory size: 0 GB - 16 GB
... Overview
COM Express® Rel. 3.1 Type 6 computer-on-module SOM-COMe-CT6-TWL featuring Intel® Core™ i3 and Intel® Processors N Series (codename: Twin Lake). Compact 95 x 95 mm form factor designed for embedded and industrial systems.
Highlights
- CPU:
SECO
Memory size: 0 GB - 96 GB
... Overview
COM Express® 3.1 Type 6 Compact Module SOM-COMe-CT6-P100 featuring AMD Ryzen™ AI Embedded P100 Series processors. Compact 95 x 95 mm module designed for embedded applications requiring AI acceleration, multimedia and extensive I/O options.
Highlights
- CPU
SECO
Memory size: 0 GB - 96 GB
... Overview
COM Express Rel. 3.1 Type 6 module featuring Intel® Core™ Ultra Series 3 processors (codename: Panther Lake-H), designed for high-performance embedded and edge systems requiring AI acceleration, multi-display support and extensive I/O.
Highlights
- CPU:
SECO
Memory size: 0 GB - 16 GB
... SMARC® Rel. 2.1.1 Computer on Module with NXP i.MX 95 Applications Processors, delivering optimized processing and advanced Machine Learning acceleration for next-generation edge computing applications. Graphics - GPU Arm Mali-G310 V2 with 2D/3D ...
SECO
Memory size: 0 GB - 96 GB
... Product overview
COM Express Rel. 3.1 Type 6 module SOM-COMe-BT6-PTL based on Intel® Core™ Ultra Series 3 processors (codename: Panther Lake-H). Designed for embedded systems requiring high compute, integrated graphics, on-board AI acceleration ...
SECO
Memory size: 2 GB - 8 GB
... Unleash the full potential of the NXP i.MX8M Mini, featuring ARM® Cortex®-A53 processor. This empowers Artificial Intelligence (AI) and Machine Learning (ML) capabilities, enhances multimedia performance, supports cutting-edge Edge Computing, provides ...
VEST
Memory size: 2 GB - 8 GB
... Unleash the full potential of the NXP i.MX8M Plus, featuring ARM® Cortex®-A53 processor and Neural Processing Unit (NPU). This empowers Artificial Intelligence (AI) and Machine Learning (ML) capabilities, enhances multimedia performance, supports cutting-edge ...
VEST
Memory size: 2 GB - 8 GB
Unleash the full potential of the NXP i.MX8M Plus, featuring ARM® Cortex®-A53 processor and Neural Processing Unit (NPU). This empowers Artificial Intelligence (AI) and Machine Learning (ML) capabilities, enhances multimedia performance, supports cutting-edge ...
VEST
Memory size: 2 GB
The MYC-J1028X SOM and development board are equipped with the LS1028A processor with a dual-core Cortex™-A72 CPU at 1.5GHz, including Ethernet switches and Ethernet controllers for time-sensitive networking (TSN); Two powerful 64-bit Arm®v8 cores support ...
MYIR Electronics Limited
Memory size: 1, 2 GB
STM32MP257 is a microprocessor launched by ST for industrial applications, with a dual-core Cortex-A35 64-bit core up to 1.5GHz and an integrated 400 MHz Cortex-M33 core. Features single-precision floating-point unit (FPU), digital signal processing (DSP) ...
MYIR Electronics Limited
... Introduction
The Edge AI SoC Module is a compact, high-performance computing module delivering on-device AI and advanced video processing for vision-based products. It provides flexible camera interfaces and multiple network options to accelerate ...
... Product overview
The AI SoC Module (Model 291940090) is a compact edge computing module designed for efficient on-device AI inference and real-time video processing. It targets integrators and OEMs building security, industrial automation and ...
Memory size: 2 GB - 8 GB
... Product overview
The Edge AI SoM computing module delivers scalable AI acceleration and multimedia processing for security, industrial automation and smart IoT at the edge. Built for real-time video analytics, predictive maintenance and autonomous ...
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