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These benchtop machines offer technologically advanced, low cost solutions for low to medium volume surface mount placement applications. These systems are specifically designed for facilities where quick set-up, ease of operation and high reliability are paramount.
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Placement area:
- max. 400x500mm
Component range:
- from 0402 to 25x25 ( option 40x40 )
- min pitch 0,4mm
- BGA / µBGA
components packgage:
- tapes / sticks / trays / bulk
Components centering:
- non-contact alignment
Placement rate:
- up to 800 cph.
Feeder capacity:
- max 80 x 8mm - tape strips
- and 2 x (300 x 200mm) - IC-tray
- with 200 x 300mm PCB size
Resolution:
- X / Y Axis - 0,008mm
Placement accuracy:
- +/- 0,08mm
Dimensions and weight:
- 840 x 630 x 430 mm / ca. 65 kg
Supply:
- 230V-50Hz -350W / 0,6 MPa - 15l/min
KEY FEATURES:
- desktop SMT pick and place machine
- automatic pick & place head
- automatic nozzle changer ( 6 tools )
- top camerasystem for automatic fiducial
- bottom camerasystem for touchless components centering
- Gerber - and CAD editor ( all CAD-systems)
- teach-in mode - electronic manipulator
- image processing system
- operating system: Windows XP
- control panel: PC keybord / Mouse
- user interface - PC and 17" LCD monitor
Application area:
- suitable for small and medium volume production
- qualified for pick & place of standard and fine pitch components
- incl. BGA and µBGA
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These manual pick and place systems are designed specifically for low volume and prototyping assembly runs for the second stage of the SMT assembly process - placing components on the board assembly.
Our Gold-place systems offer many unique features and benefits:
1) Its patented hand rest and arm assembly alleviates operator fatigue by supporting the operator's hand and arm throughout the entire assembly process;
2) Its patented, movable ESD safe component trays enhance operator performance, regardless of board size, by allowing trays to be next to the placement area;
3) The Auto-pick feature automatically toggles on and off the vacuum tip during component pick-up and placement. This allows for picking components from tape
feeders without having to press down on the tape.
4) The digitally timed dispenser accurately deposits solder paste, adhesives and various potting compounds, while storing up to 99 memory settings;
5) Our optional Video Display System enhances overall component placement capabilities, including fine pitch devices.
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SUMMARY:
- Dual Gantry 4 Heads
- High Accuracy and high Flexibility for 0201 (0.6 mm x 0.3 mm), SOIC, PLCC, BGA, µBGA, CSP, QFP (0.3 mm pitch)
- Smart Feeder System provides Automatic feeder position checking, Automatic component counting, Production data Traceability
- Perfect for medium and high volume production
- COGNEX Alignment System "Vision on the Fly"
- Bottom Vision Alignment System for fine pitch QFP & BGA
- Built in Camera System with Auto Smart Fiducial Mark Learning
- Vision Inspection before and after production
- Windows 2000 Software
- Universal CAD Conversion
- Placement rate: up to 10.500 CPH
- Ball Screw Systems in X- and Y-Axes
- Conveyor System with SMEMA Interface and automatic width control
- Suitable for 64 intelligent Auto Tape Feeder
- Non-Contact Linear Encoder System
- Rapidly changeable Feeder Trolley
- Strong and rigid mechanical design
The SMT Pick & Place Machines of BS683-series were especially designed for medium and high volume batch sizes. With the two row of dual-head (4 multi-head in total), both row of heads can pick up the components, and place the components steadily in alternation.
Non-contact Linear Encoders together with DC-servo motors provide an extremely high repeatability and stability.
Additionally, the BS683-series feature COGNEX vision processing and head-mounted for non-contact "Vision on the Fly" alignment.
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When you're looking for highly productive, low cost per placement and exceptional quality - Panasonic's BM123 and BM133 modular placement machines are the answer.
Panasonic's eight-nozzle independent vertical drive system ensures expansion of component gang pick-up and focused recognition scans; thereby, delivering reliable accuracy to 0.12 s/chip (30,000 cph). The integrated line scan sensor measures component thickness - administering consistent force and placement.
Placing components from 0402 (01005) chips to 32 x 32mm QFP and BGA chips, it's small footprint 1950 x 1710mm, and easy to use, interactive design make the BM123 and BM133 the continuous quotient in any decision matrix.
Features & Benefits
Speed
Low cost per placement
Wide component range
Reliable Accuracy
Wide component capability from 0402 (01005) chips to 32 x 32mm QFP and BGA chips on up to 18" x 22" boards
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* Pick & Place system M1-compact contains
* Table support for PCB’s
* Two magnetic placeholders for PCB’s
* Arm support, anti static
* Built in vacuum pump with air switch.
* Vacuum hand pipette
* Two anti static trays, each containing 42 bins with covers.
* Dimensions: 590 x 250 x 70mm
* Max. PCB dimension: 200 x 240mm
* Power: 12VAC 50/60Hz
* Weight: 6,4 kg
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