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COM Express computer modules are perfect for OEMs designing computing platforms into equipment for industrial or harsh environments, and when reducing the overall design cycle and lowering validation costs are of key importance. Available with both Intel ...
Memory size: 0 GB - 12 GB
... SMARC® 2.1.1 module powered by Qualcomm® QCS6490 processor Video Resolution - Primary display: FHD+ @120 fps Secondary display: up to 4k Ultra HD @60Hz Audio 2x I2S Serial Ports 2x UART (RX/TX/RTS/CTS), 2x UART (RX/TX) Other Interfaces 2C Ultra ...
SECO
Memory size: 12 GB
... SMARC® 2.1.1 module with Qualcomm® QCS5430 processor Cpu 2x Arm® Cortex®-A78 @2.4 GHz, 4x Arm® Cortex®-A55 Memory Soldered-down LPDDR5-6400 memory, up to 12GB total, 32-bit interface 2 channels Graphics Qualcomm® Adreno™ 642L Video Interfaces LVDS ...
SECO
Memory size: 0 GB - 8 GB
... SMARC® Rel. 2.1.1 Computer on Module (CoM) with MediaTek Genio 700 Applications Processors Audio - 2x I2S port Serial Ports - 2x UART (4-wires) 2x UART (2-wires) Other Interfaces - GPIOs MIPI-CSI camera interface General Purpose ...
SECO
Memory size: 8 GB
... Overview
The QRB812 is an Open Standard Module (OSM 1.1) System-on-Module from DFI based on the Qualcomm QRB5165 SoC. It is engineered for compact industrial and embedded applications such as AMR, robotics and drones, where multi-camera support, ...
DFI
Memory size: 4, 8, 16 GB
... The EHL701 is a Qseven System-on-Module by DFI for embedded and industrial applications, supporting Intel® Atom® x6000 series and Intel® N/J series processors in a compact 70 × 70 mm Qseven form factor.
Key features
- Form factor:
DFI
Memory size: 0 GB - 16 GB
... Product Overview
- Intel® Atom® Processor Elkhart Lake Series
- Dual Channel LPDDR4X 3200MHz/4267MHz up to 16GB
- 1 LVDS/eDP, 1 DDI (HDMI/DP++); Supports dual displays: DDI + LVDS/eDP
- Multiple expansions: 4 PCIe x1
- Rich
DFI
... SMARC specification 2.1.1 compliant Qualcomm® QRB5165 octa-core SoC Support for up to 6 cameras Up to 8GB LPDDR4, up to 256GB UFS (optional) Dual GbE, 4x PCIe Gen3 lanes, USB 3.1 Real-time I/O (GPIO, UART, I2C, SPI) Rugged ...
... An advanced System On Module (SOM) solution is now available from ARBOR Technology designed to accelerate the development of IoT applications. The SM1200 is capable of driving 4K displays and multiple touch screens and supports the processing of high-resolution ...
The COMeT10-3900 is an industrial COM Express® Type 10 Mini module with an Intel Atom® E3900 processor. This low power, industrial module was designed and manufactured in the USA. The small form factor module is designed as a processor mezzanine that ...
Memory size: 2, 4 GB
Allwinner T527 high-performance processor is founded on an eight-core Cortex-A55 + HiFi4 DSP + RISC-V multi-core heterogeneous industrial-grade processor, with selectable AI2 Tops models. LPDDR4/LPDDR4x Max. 4GB 32bits; It supports H.265 4K@60fps and ...
MYIR Electronics Limited
Memory size: 4, 8 GB
... Embedded SMARC v2.1 SoM MTK Genio 510 Processor • SMARC 2.1 (82 x 50 mm) • MTK Genio 510 Processor • 4GB LPDDR4X, 32GB eMMC ...
AmbiWorks
... COM Express Type 6 Basic module based on 11th Generation Intel® Core™ processor family (code name "Tiger Lake-H") Embedded/Industrial use condition Extended temperature options available PCI Express Gen 4 AI/DL Instruction Sets including VNNI Optional ...
Congatec
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