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COM Express® Basic V2000 with AMD Embedded V-Series high-performance “Zen2” CPU Specifications Up to 64 GByte DDR4 memory (2x 32 GByte dual-channel DDR4 SO-DIMM) Up to 8 PCIe lanes (4x PCIe 3.0 (up to 8 GT/s) 4x PCIe 2.0 ...
Kontron
The COMe-mEL10 (E2) is a credit card sized Computer-on-Modules platform based on the Intel® Atom® x6000 Series, Pentium® and Celeron® processors. The COMe-mEL10 (E2) performance range of COM Express mini modules is highly scalable ...
Kontron
Up to 48 GByte DDR4 memory (16 GByte DDR4 memory down) Up to 2.5 Gb Ethernet with TSN support Optional NVMe SSD onboard Industrial grade versions
Kontron
COM Express computer modules are perfect for OEMs designing computing platforms into equipment for industrial or harsh environments, and when reducing the overall design cycle and lowering validation costs are of key importance. Available ...
SMARC® Rel. 2.1.1 Computer on Module (CoM) with Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series (Codename: Elkhart Lake) Processors for FuSa applications. CPU Intel® Atom® x6000E Series and Intel® Pentium® ...
SECO S.p.A.
SMARC® Rel. 2.1.1 Computer on Module (CoM) with MediaTek Genio 700 Applications Processors. CPU MediaTek Genio 700 Graphics Mali G57 MC3 GPU Connectivity Up to 2x Gb Ethernet, 1x USB 3.1, 2x USB 2.0, 1x CAN, 4 x UART, opt ...
SECO S.p.A.
Description COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 8th Gen Intel® Core™ and Celeron™ U-series (Codename: Whiskey Lake-U) Processors. Processor - Intel® Core™ Î7-8665UE, Quad Core @ 1.7GHz (Turbo Boost ...
SECO S.p.A.
SMARC specification 2.1.1 compliant Qualcomm® QRB5165 octa-core SoC Support for up to 6 cameras Up to 8GB LPDDR4, up to 256GB UFS (optional) Dual GbE, 4x PCIe Gen3 lanes, USB 3.1 Real-time I/O (GPIO, UART, ...
Intel® Atom® Processor Elkhart Lake Series Dual Channel LPDDR4X 3200MHz/4267MHz up to 16GB 1 LVDS/eDP, 1 DDI (HDMI/DP++)；Supports dual displays: DDI + LVDS/eDP Multiple expansions: 4 PCIe x1 Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0 15-Year ...
DFI
AMD® Ryzen™ R1000 Series Processor Single Channel LPDDR4 2400MHz；Memory Down up to 8GB 1 LVDS/eDP, 1 DDI (HDMI/DP)；Supports dual displays: DDI + LVDS/eDP Multiple expansions: 3 PCIe x1 Rich I/O: 1 Intel GbE, 2 USB 3.1, 8 USB 2.0 10-Year ...
DFI
11th Generation Intel® Processor COM Express® Compact DDR4 3200MHz SODIMM up to 64GB VGA/DDI + LVDS/eDP + DDI DP++ supports 4K x 2K resolution Multiple expansion: 8 PCIe x1, 1 I2C, 1 SMBus Rich I/O: 1 Intel 2.5GbE, 4 USB 3.1, 8 USB 2.0 15-Year ...
DFI
An advanced System On Module (SOM) solution is now available from ARBOR Technology designed to accelerate the development of IoT applications. The SM1200 is capable of driving 4K displays and multiple touch screens and supports the ...
The COMe-cVR6 (E2) deliver a new generation of high-performance, feature-rich Computer-on-Modules based on the standardized COM Express® compact form factor and AMD’s Ryzen Embedded V/R-Series processors. Through the use of consistent ...
Kontron America
The COMeT10-3900 is an industrial COM Express® Type 10 Mini module with an Intel Atom® E3900 processor. This low power, industrial module was designed and manufactured in the USA. The small form factor module is designed as a processor ...
COM Express Type 6 Basic module based on 11th Generation Intel® Core™ processor family (code name "Tiger Lake-H") Embedded/Industrial use condition Extended temperature options available PCI Express Gen 4 AI/DL Instruction Sets including ...
Congatec
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