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... for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The Model 200IR Mask Aligner is capable of one micron resolution and alignment precision. ...
... The EVG®610 is a compact and multi-purpose R&D system that can handle small substrate pieces and wafers up to 200 mm. The EVG610 supports a variety of standard lithography processes, such as vacuum-, hard-, soft-, and proximity exposure ...
EV Group
... The EVG®620 NT provides state-of-the art mask alignment technology on a minimized footprint area up to 150 mm wafer size. Known for its versatility and reliability, the EVG620 NT provides state-of-the-art mask ...
EV Group
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