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Edge AI computer VC500-CMS-MXM
wall-mountedin-vehicle10th generation Intel® Core™

Edge AI computer - VC500-CMS-MXM - DFI - wall-mounted / in-vehicle / 10th generation Intel® Core™
Edge AI computer - VC500-CMS-MXM - DFI - wall-mounted / in-vehicle / 10th generation Intel® Core™
Edge AI computer - VC500-CMS-MXM - DFI - wall-mounted / in-vehicle / 10th generation Intel® Core™ - image - 2
Edge AI computer - VC500-CMS-MXM - DFI - wall-mounted / in-vehicle / 10th generation Intel® Core™ - image - 3
Edge AI computer - VC500-CMS-MXM - DFI - wall-mounted / in-vehicle / 10th generation Intel® Core™ - image - 4
Edge AI computer - VC500-CMS-MXM - DFI - wall-mounted / in-vehicle / 10th generation Intel® Core™ - image - 5
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Characteristics

Type
Edge AI
Configuration
in-vehicle, wall-mounted
Processor
Intel® Xeon® W-1270TE, 10th generation Intel® Core™, Intel® Core™ i3-10100TE, Intel® Core™ i9-10900TE, Intel® Core™ i5-10500TE, Intel® Core™ i7-10700TE, Intel® Core™ i3-10100TE
Ports
DDR4 SO-DIMM, HDMI, M.2 Key B, RS-232, CAN bus, RS-485, WiFi, RS-422, RJ45, M.2 Key M, MXM, 5G, RAID, M.2 Key E, Bluetooth, Mini PCIe, USB 3.1, dual SIM, SATA, M.2
Operating system
Linux® Ubuntu™, Windows 10 IoT Enterprise, Windows 11 IoT Enterprise
Protection level
MIL-STD-810G
Other characteristics
SSD, PoE, HDD

Description

Product Overview
  • High Performance Fan-less Edge AI In-Vehicle System
  • Supports 10th Gen Intel® Xeon/Core™/Pentium/Celeron Processors
  • 4x M12/RJ45 802.11af PoE or 2x 10G SFP+ Ports
  • Supports MXM GPU module with Four Display Ports
  • 1 miniPCIe and 4 M.2 slots for CAN bus/LTE/5G/WiFi/Storage modules
  • Supports M.2 B key 3042/3052 5G-NR module with dual SIM
  • OOB management support upon request
  • 15-Year CPU Life Cycle Support Until Q1' 34 (Based on Intel IOTG Roadmap)

Features
  • Fanless Design
  • Mini PCIe
  • Multiple Expansion
  • 15 Years CPU Life Cycle Support
  • DDR4
  • Wide Voltage: 9~48V DC-in

Certifications
  • FCC Certification
  • E-Mark (E24) Certification

System Specifications
  • Processor: 10th Gen Intel® Xeon/Core™/Pentium/Celeron Processors, LGA 1200 Socket
    - Intel® Xeon-1270TE (8 Cores, 16M Cache, up to 2.0/4.4 GHz); 35W
    - Intel® Core™ i9-10900TE (10 Cores, 20M Cache, up to 1.8/4.5 GHz); 35W
    - Intel® Core™ i7-10700TE (8 Cores, 16M Cache, up to 2.0/4.4 GHz); 35W
    - Intel® Core™ i5-10500TE (6 Cores, 12M Cache, up to 2.3/3.7 GHz); 35W
    - Intel® Core™ i3-10100TE (4 Cores, 6M Cache, to 2.3/3.6 GHz); 35W
  • Chipset: Intel® Q470E/W480E Chipset
  • Memory: Dual SO-DIMM slots (horizontal type) with anti-vibration bracket, Dual Channel DDR4 2933/2666/2400/2133 SDRAM, up to 64GB, ECC support for Xeon-1270TE processor only
  • BIOS: AMI SPI 256Mbit

Graphics
  • Controller: Intel® processor integrated or Independent MXM module by BIOS selection
  • Display: 4 x Display Ports with lock holes from MXM, 1 x HDMI combo port and 2 x DP++ ports from CPU
  • Compatible MXM: Type A or B MXM modules: RTX A2000, RTX3000, A500, A1000

Storage
  • External: 2 x swappable 2.5" SATA drive bays with lock on rear panel, Supports RAID 0/1
  • Internal: 1 x M.2 2280 M Key slot, supports 2242, 2260 & 2280 devices, PCIe x4 & SATA signal, support boot up function
  • Interface: SATA

Audio
  • Audio Codec: ALC 888
  • Interface: 1 x Mic-in, 1 x Line-in

Ethernet
  • Controller: 1 x Intel® i219LM with iAMT11.0 support (Core i7/i5 only), 1 x Intel® i210IT

LED Indicators
  • 1 x Storage Activity (Red)
  • 1 x Power (Green)
  • 2 x Programmable general purpose (Green, Blue)

Front I/O
  • 2 x RJ45 GbE ports
  • 1 x DB-9 RS232 ports (COM 5)
  • 4 x USB 3.1 Gen2
  • 1 x Line-out, 1 x Mic-in and 1x Line-in with 3.5mm audio jacks
  • 2 x Isolated DIO port by 2 x DB-15 female connectors (8bit DI & 8 bit DO with 2KV isolation)
  • 2 x antenna holes
  • W3 3 pin connector (DC in)
  • Optional RJ45 port for OOB management
  • 4 x 802.11af PoE ports at RJ45 or M12 X-coded connectors, max 15.4W (PSE side) or 2 x 10G fiber ports at SFP+ cage based on Intel X710-BM2 Ethernet controller

Rear I/O
  • 4 x DB-9 RS232/422/485 ports by BIOS selection (COM 1/2/3/4)
  • 4 x USB 3.1 Gen2
  • 4 x Display Ports with lock holes from MXM
  • 1 x DP++/HDMI combo port and 2 x DP++ ports from CPU
  • 1 x Power Button
  • 1 x Reset Button
  • 2-pin remote switch
  • 2 x antenna holes
  • 3 x accessible SIM slots with cover bracket
  • 2 x DB-9 ports for CAN bus (optional)

Side I/O
  • 2 x antenna holes on right side
  • 2 x antenna holes on left side

Internal I/O
  • 1 x 2x5 pin block header for RS232
  • 1 x mini PCIe slot with SIM holder on faceplate (Supports WiFi/BT/LTE or CAN bus module)
  • Total 3 x M.2 slots:
    • 1 x 2230 E-key slot (PCIe x1 & USB2.0)
    • 1 x 3042/3052 B-Key (USB3.0 & PCIex1) with dual SIM slots on faceplate
    • 1 x 2242/2280 M-Key-slot (PCIe gen3 x4 & SATA) supporting Intel® Optane memory (Both of the M10 and H10) and NVMe

Cooling
  • Passive cooling by default
  • Optional Fan cooling upon request

Security
  • Supports dTPM2.0 by default (disabled by BIOS setting)
  • Optional fTPM2.0 supported

Hardware Monitor
  • Support 3-axis femto accelerometer
  • User-selectable ±2g/±4g/±8g/±16g scale
  • Supports 6D/4D orientation detection, Free-fall detection, Motion detection and sleep-to-wake and return-to-sleep

Power
  • 3pin 3W3 connector
  • Wide Range 9~50VDC with power management (on/off delay) and ignition

OS Support
  • Windows 10 IoT Enterprise RS5
  • Windows 11 IoT Enterprise LTSC SW
  • Ubuntu Linux 20.04

Environment
  • Operating Temperature: -20°C to 60°C (without turbo boost and throttling is expected)
  • Storage Temperature: -40°C to 85°C
  • Relative Humidity: 10% to 95% (non-condensing)

Mechanism
  • Construction: Metal + Aluminum
  • Mounting: Wall mount
  • Dimensions (W x H x D): 346mm x 87.55 mm x 221mm
  • Weight: 6.95 Kg
  • Color: Black and Silver

Standards and Certifications
  • Shock: MIL-STD-810G Method 516.6, Procedure 1, OP:10G 11ms, Non-OP: 40G 11ms (Test by SSD, HDD is not support)
  • Vibration: MIL-STD-810G Method 514.6C-3, Category 4 Composite wheeled vehicle Table 514.6C-VI
  • Certifications: FCC, E-Mark

Packing List
  • 1 VC500-CMS-MXM system unit
  • 1 Power connector
  • 1 Mounting bracket
  • 1 3W3 adaptor cable

Country of Origin
  • Taiwan

Ordering Information
  • VC500-CMS-MXM-10G-Q: Intel® Q470E Chipset, 8 USB 3.1, 1 DI, 1 DO, 2 10GLAN, 1 MXM slot, Power: 3pin 3W3 connector
  • VC500-CMS-MXM-POE-Q: Intel® Q470E Chipset, 8 USB 3.1, 1 DI, 1 DO, 4 (RJ45) POE, 1 MXM slot, Power: 3pin 3W3 connector
  • VC500-CMS-A1000-POE-Q-i70: Intel® Core™ i7-10700TE, Intel® Q470E Chipset, 8 USB 3.1, 1 DI, 1 DO, 4 (RJ45) POE, 1 MXM-A1000 slot, Power: 3pin 3W3 connector

Optional Items
  • 2.5" SSD: 1TB/512GB/256GB/128GB MLC, -40 to 85°C, RoHS
  • M.2 SATA SSD: 64GB/128GB/256GB/512GB, M.2 2280 SSD, SATA3 B+M Key, MLC, Wide Temp.
  • Memory: 4GB/8GB DDR4 2666Mhz SO-DIMM, -40 to 85°C
  • WiFi/BT module kit: WiFi/Bluetooth Module AP12356, antenna *2, 200mm SMA cables*2, Mini PCIe Bracket, screws
  • LTE module kit: Quectel EG25GGB CAT4 miniPCIe module, antenna*2, 300mm SMA cables*2
  • 5G module kit: SIM8202G-M2 M.2 module, antenna*4, 184mm SMA cables *4
  • M12 Cable: 8-pin M12 X-coded to RJ45 PoE cable
  • CAN bus module: MPE-CAN2 MiniPCIe Full CAN Module Card Assembly
  • Power Switch Cable: 3W3 to terminal block 2*4P/4.2mm, L=250 & 300mm with ignition switch button
  • Power Adapter: 330W, GST360A, Input: 85~264V, Output: 12V/27.5A, 220x95x46mm, L=1000mm, C8P, LV6, 62368-1, GST360A12-C8P(MEAN WELL)RoHS

Technical Specifications (Summary)
  • Processor: 10th Gen Intel® Xeon/Core™/Pentium/Celeron, LGA 1200
  • Chipset: Intel® Q470E/W480E
  • Memory: Up to 64GB DDR4, ECC support (Xeon only)
  • Storage: 2 x 2.5" SATA, 1 x M.2 2280 M Key
  • Expansion: 1 x miniPCIe, 4 x M.2 slots
  • Display: 4 x DP (MXM), 1 x HDMI/2 x DP++ (CPU)
  • Ethernet: 4 x PoE or 2 x 10G SFP+
  • Operating Temp: -20°C to 60°C
  • Certifications: FCC, E-Mark
  • Dimensions: 346mm x 87.55 mm x 221mm
  • Weight: 6.95 Kg

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