The RM810-ERX810 is a 1U rackmount edge-server system designed for demanding edge and server applications. It supports 5th and 4th Gen Intel® Xeon® Scalable processors, provides flexible storage and expansion, and includes out-of-band IPMI management for remote operation. It targets high-availability, high-density deployments requiring serviceability and extensive I/O.
Key features:- Dual-processor architecture supporting 5th and 4th Gen Intel® Xeon® Scalable families.
- Single-slot PCIe x16 for GPU or accelerator/IO cards.
- Four hot‑swappable 3.5/2.5‑inch drive bays for in-place storage servicing.
- IPMI-based out-of-band (OOB) management with BMC AST2600.
- 1U rackmount chassis optimized for edge and server deployments.
Technical specifications:- Processor: Supports 5th and 4th Gen Intel® Xeon® Scalable (LGA 4677).
- Chipset: Intel® C741.
- Memory: 16 x ECC RDIMM slots, up to 1024 GB, DDR5 up to 5600 MHz.
- BIOS / BMC: Insyde BIOS; BMC AST2600 with IPMI (OOB management).
- Display / Audio: 1 x DisplayPort; audio codec ALC888S.
- External storage: 4 x SATA 3.0, RAID 0/1/5/10 supported.
- Internal storage: 1 x M.2 2280 M-Key.
- Expansion: 1 x PCIe x16 (single-slot GPU/IO card support).
- Ethernet: 4 x Intel® I210 GbE controllers; dedicated IPMI LAN (RTL8211F).
- Front I/O: 4 x GbE, 1 x IPMI LAN, 1 x RS-232/422/485 (DB-9), 4 x USB 3.2 Gen1, 1 x DP, LED indicators.
- Cooling: Six 40 mm fans.
- Security: TPM 2.0 supported.
- Power supply: 1U redundant PSU.
- Operating environment: Operating 0–35°C; storage -30–60°C (with RTC battery), -40–85°C (without RTC); 5–90% RH non‑condensing.
- Mechanics: Industrial steel chassis; dimensions (W x H x D) 431.8 x 650.8 x 44 mm; color: black.
- Packing list: 1 x RM810-ERX810 system unit. Country of origin: Taiwan.
Applications:- Edge computing and distributed data center nodes.
- Telecom/telecom edge, network appliances and industrial automation.
- Video analytics, storage servers and single‑slot GPU/accelerator inference workloads.