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EATX motherboard IS-5222
Intel® XeonIntel® Q670EDDR4-RDIMM

EATX motherboard - IS-5222 - DFI - Intel® Xeon / Intel® Q670E / DDR4-RDIMM
EATX motherboard - IS-5222 - DFI - Intel® Xeon / Intel® Q670E / DDR4-RDIMM
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Go to the DFI website for more information

Characteristics

Format
EATX
Processor
Intel® Xeon
Chipset
Intel® Q670E
Memory
DDR4-RDIMM
Extension slot
M.2, M.2 Key M, 16x PCI Express, 2 PCIe x8
Applications
embedded, server
Operating system
Windows 10 IoT Enterprise
Memory frequency
DDR4 3200 MHz
Connectivity
USB 2.0, USB 3.1, VGA, RJ45, RS-232, GbE

Description

Overview

  • The IS-5222 is an EATX server motherboard from DFI engineered for edge servers and high-performance embedded systems, supporting 3rd Gen Intel® Xeon® Scalable processors, large memory capacity and multiple high-speed expansion slots.


Key specifications

  • Processor: 3rd Gen Intel® Xeon® Scalable Processor Family, LGA 4189 (Socket P+), TDP up to 205W.
    • Supported CPU examples: Intel® Xeon® Gold 6338N, 6338T, 6336Y, 6330, 6330N, 6326, 5320T, 5318N/5318Y, 5317, 5315Y, Intel® Xeon® Silver 4316/4314/4310/4310T.
  • Chipset: Intel® C621A.
  • Memory: 16 x 288-pin ECC RDIMM up to 1024 GB; DDR4 up to 3200 MHz (single channel).
  • BIOS: AMI 64Mb SPI BIOS.
  • BMC / Management: AST2500 BMC.
  • Display: 1 x VGA (DB-15), up to 1920 x 1200 @ 60Hz (single display).


Expansion and storage

  • 1 x M.2 2280 M key (PCIe Gen3 x1 NVMe); 3 x PCIe x16 Gen4 slots; 2 x PCIe x8 Gen4 slots.
  • SATA & RAID: 2 x SATA 3.0 (up to 6 Gb/s); RAID 0/1 supported.


Connectivity

  • Rear I/O: 2 x 10GbE (RJ-45) LAN; 1 x dedicated IPMI LAN; 2 x USB 3.1 Gen1 (rear); 1 x VGA (DB-15, rear).
  • Internal I/O: 2 x RS-232 (2x5-pin); 2 x USB 3.1 Gen1 (internal); 4 x USB 2.0 (internal).


Power, environment & mechanics

  • Power: ATX type; connectors: 8-pin ATX 12V CPU and 24-pin ATX power.
  • Operating temperature: 0 to 40°C; Storage: -40 to 85°C. Operating/storage humidity: 5–90% RH (non-condensing).
  • Mechanics: EATX form factor; dimensions 305 mm x 330 mm; PCB thickness 1.6 mm.


Compliance & documentation

  • Standards: CE, FCC. Country of origin: Taiwan. MTBF: TBD.
  • OS support: Windows 10 IoT Enterprise LTSB RS5 (64-bit).
  • Documentation: IS-5222 Datasheet (PDF).

Catalogs

Go to the DFI website for more information

Other DFI products

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.