Thin-film inspection system Xtrology

semiconductorautomatedthickness

The new product, "Xtrology," Fully Automated Thin Film Inspection System*1 has made it possible to perform important inspections, such as film thickness measurement, defect analysis, and composition analysis of various wafers with a single instrument. In recent years, the number of inspection items in the manufacturing process has increased due to technological advances in the semiconductor industry, and the level of inspection requirements continues to rise. Xtrology conducts the inspection and defect reviews on a wide range of wafer sizes and materials used in legacy and cutting-edge processes for silicon and compound semiconductor-based devices. We offer a variety of solutions by integrating a variety of sensors and automation technologies developed independently based on HORIBA's core technology into one platform. 1. Customization of sensors and specifications for customers’ inspection needs "Xtrology," is a highly customizable system that allows you to select one or multiple sensors from three analysis methods: spectroscopic ellipsometry*2, Raman spectroscopy*3, and photoluminescence*4. This has made it possible to perform important inspections of various wafers with a single instrument. Film Thickness - Measurement of film thickness and film quality, single or multiple layers analysis Optical Properties - Measurement of n (light refractive index), k (extinction coefficient*5), and Eg (bandgap*6) Crystallinity - Uniformity assessment of the material crystal structure, etc. Composition / Stoichiometry - Analysis of material ingredients and content, and uniformity assessment Defects Inspection - Defect location, classification, and particle inspection and identification