OverviewGlovebox laser welding system providing an integrated, monitored and controlled glovebox environment combining IPG fiber laser welding capability with an automated multi-axis motion platform. Designed for precision hermetic welding in contamination‑sensitive industries including medical devices, aerospace electronics and semiconductor components.
ApplicationsPrecision welding of hermetically sealed medical devices; welding of aerospace electronic assemblies; welding and packaging of semiconductor components; production tasks requiring stringent atmosphere control and contamination avoidance.
Key features- Controlled glovebox welding atmosphere with environmental monitoring and gas analysis
- IPG fiber laser sources selected to match the application, including Quasi‑CW options to minimize heat‑affected zone
- Automated multi‑axis motion platform for repeatable, high‑yield welding
- Optional wobble welding heads for gap compensation and reduced cracking/porosity
- Integrated process camera and programmable illumination for in‑process alignment and inspection
Configurable design & options- Glove ports configurable: 2, 3 or 4
- Primary and secondary antechamber options for safe part transfer with automatic cycling and door locking
- One or more vacuum bakeout ovens with stored programs and 1–3 shelves; oven control to 200°C with active cooling
- Dual‑column gas recirculators reducing O2 and H2O to ~1 PPM (continuous operation)
- Automatic double‑valve soot/smoke removal system with removable collection vessel for reactive materials (e.g., titanium)
- Advanced gas control and analysis (He, H2O, O2) with programmable alarms
Fully Integrated System ControlCentralized IPGCore control coordinates laser parameters, motion axes and environmental systems. Vision integration enables automated alignment; laser output can be adjusted in real time linked to motion profiles. Process head programming and automatic error responses support repeatable production runs.
Wobble Welding HeadsOptional wobble heads increase weld robustness on difficult materials by accommodating part gaps, distributing heat input and reducing defects such as cracking and porosity—improving part yield for tight production tolerances.
NotesStandard specifications are shown; systems are modular and can be customized to meet specific process or regulatory requirements. Product availability and configuration options may vary by region.
Technical specifications- Glove Ports: 2, 3 or 4
- XYZ Working Range: 1220 x 910 x 890 mm
- Primary Antechamber: ⌀ 380 x L 610 mm
- Secondary Antechamber: ⌀ 150 x L 370 mm
- Oven Drying Antechamber: ⌀ 380 mm; controlled to 200° C; active cooling for shorter bake cycles
- Display & Operation: 22" LCD touchscreen monitor
- Controller Software: IPGCore
- Automatic Soot Removal: double‑valve system with removable collection vessel
- Environmental Controls: dual gas purifiers with monitoring
- Footprint: dependent on number and configuration of antechambers
- IPG Laser Source: application‑matched selection (internal or external integration)
- Beam Delivery Head: IPG welding head; optional wobble head
- Camera System (option): high‑resolution video with live imaging
- Lighting (option): programmable illumination with HMI control
- Motion Control: 2‑Axis X‑Y joystick or 4‑Axis jog‑box pendant