CNC drilling machine

verticalhigh-speedlaser

Overview
LaserCube Driller is a laser drilling system engineered to drill hundreds of uniformly spaced holes per second across large flat parts (filters, perforated sheets). It provides a 1 x 1 m process area within a compact 3.0 x 3.9 m footprint and supports fast changeover between part designs. Optional programmable cutting allows singulation or extraction of finished parts.

Key Capabilities

• Drilling speed: up to 300 holes/sec
• Hole diameter range: 60–3500 µm (configuration dependent)
• Maximum part thickness: up to 3 mm (configuration dependent)
• Compatible with all metals, including magnetic and reflective materials (copper, aluminium)
• Support for multiple hole shapes (round, hexagon, square) and mixed hole types in one job
• Non-contact process requiring only compressed air and electricity

Performance & Reliability

• IPG fiber laser sources selected per application for high beam quality and speed
• High power stability for consistent processing quality
• Low-maintenance design: no gases, no mirror alignment, no consumables

System Components & Usability

• Granite base for vibration damping and structural stiffness
• Direct-drive linear motors for high positioning accuracy and speed
• Mechanical clamping tooling for parts handling
• Operator interface: 17" monitor with keyboard and mouse; CAD import and automatic hole-array generation

Applications

• High-volume drilling of industrial filters, perforated metal panels and large flat parts (up to 1 x 1 m)
• Production requiring high hole uniformity and tight pitch control

Technical specifications

• XY working range: 1000 x 1000 mm
• Process area: 1 x 1 m
• Positioning accuracy: ±25 μm
• Positioning repeatability: <10 μm
• Part tooling: mechanical clamping system
• Display & operation: 17" monitor with keyboard & mouse
• Controller software: CNC G-code compliant HMI
• Footprint dimensions: 3875 L x 2200 W x 1800 H mm (typ. 3.0 x 3.9 m)
• Maximum drilling speed: up to 300 holes/sec
• Hole diameter: 60–3500 μm (configuration dependent)
• Maximum part thickness: up to 3 mm (configuration dependent)
• Hole size variation: <10% of hole diameter
• Hole pitch variation: ±10 μm
• IPG laser source and IPG drilling head; laser integration internal or external