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Scanning electron microscope JSM-IT810
inspectionSchottky field emissionEBSD

Scanning electron microscope - JSM-IT810 - Jeol - inspection / Schottky field emission / EBSD
Scanning electron microscope - JSM-IT810 - Jeol - inspection / Schottky field emission / EBSD
Scanning electron microscope - JSM-IT810 - Jeol - inspection / Schottky field emission / EBSD - image - 2
Scanning electron microscope - JSM-IT810 - Jeol - inspection / Schottky field emission / EBSD - image - 3
Scanning electron microscope - JSM-IT810 - Jeol - inspection / Schottky field emission / EBSD - image - 4
Scanning electron microscope - JSM-IT810 - Jeol - inspection / Schottky field emission / EBSD - image - 5
Scanning electron microscope - JSM-IT810 - Jeol - inspection / Schottky field emission / EBSD - image - 6
Scanning electron microscope - JSM-IT810 - Jeol - inspection / Schottky field emission / EBSD - image - 7
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Characteristics

Type
scanning electron
Technical applications
inspection
Electron source
Schottky field emission
Detector type
EBSD
Other characteristics
automated, observation, real-time, alignment, topography

Description

Versatility and high spatial resolution meet automation with the JSM-IT810 series FE-SEM. No-coding automation for imaging and EDS analysis is built-in for a streamlined and efficient workflow. New functions are available to ensure high quality data and an enhanced user experience for all SEM users. Functions include the SEM automatic adjustment package, a trapezoidal correction function (useful for EBSD measurements) and Live 3D surface reconstruction for observation of surface topography. Operating a FE SEM has never been easier with the JSM-IT810 series. SEM observation and EDS analysis can be automated by simply setting the analysis conditions and selecting the areas to measure. SEM Automatic Adjustment Package (Optional): This feature uses a dedicated sample to perform magnification calibration, beam alignment, and EDS energy calibration. Regular checks ensure the equipment remains in optimal condition.Choose our multi-segmented, semiconductor type BSE detector to create a Live 3D reconstruction of the sample surface.View the 3D image in real-time to check the sample topology. Next generation operability that eliminates the barriers between observation by SEM and elemental analysis by EDS. Various analysis methods such as point, area, MAP, and line can be directly reserved on the observation screen, allowing for the immediate start of an analysis.

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Exhibitions

Meet this supplier at the following exhibition(s):

ELECTRONICA 2026
ELECTRONICA 2026

10-13 Nov 2026 Munich (Germany) Hall B1 - Stand 756

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