Diaphragm valve LD

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LD SERIES
LOW-PRESSURE MANUAL DIAPHRAGM VALVE
Overview
Manual low-pressure diaphragm valve designed for control of high-purity and ultra-high-purity gases in semiconductor, laboratory and industrial processes. Typical applications include gas distribution, purging and sampling where low entrapment and low particle generation are required.

Body

• 316L VIM-VAR stainless steel body material for ultrahigh-purity applications.
• Inner surface roughness can reach Ra 5 μin, enabling the flow channel to be completely cleaned.
• Design minimizes entrapment areas, facilitates purging and maximizes flow capacity.

Diaphragm

• Diaphragm materials: Hastelloy C-22 or cobalt-based superalloys (UNS R30003) for strength and corrosion resistance.
• Optimized design for long cycle life.

Seat

• Fully contained PCTFE seat design providing resistance to swelling and contamination.
• Improved helium leak test performance, minimal particle generation and long cycle life.
• High-cleanliness assembly and packaging suitable for the high-purity semiconductor industry.
• All units are helium-leak tested before shipment.

Technical Data
Technical drawings and data are provided as images on the product page, including dimensional drawings and flow channel illustrations.

Product Size
Dimensions (in millimeters) are provided for reference and are subject to change; consult the product drawings for detailed dimensions.

Flow Channel Form
Flow channel and internal geometry are shown in the product images to illustrate the low-entrapment, high-purity flow path.

Ordering Information
Images on the product page show standard ordering specifications; other specifications and models are available.

Technical Specifications

• Series: LD SERIES (low-pressure manual diaphragm valve).
• Body material: 316L VIM-VAR stainless steel.
• Inner surface roughness: can reach Ra 5 μin.
• Diaphragm material options: Hastelloy C-22 or cobalt-based superalloys (UNS R30003).
• Seat: fully contained PCTFE seat design.
• Performance: designed to minimize entrapment areas, facilitate purging and maximize flow capacity.
• Cleanliness: high-cleanliness assembly and packaging suitable for semiconductor/high-purity gas applications.
• Quality control: helium leak testing performed on every product.
• Documentation: dimensional drawings and flow channel illustrations provided as images on the product page.