Pinch valve LD

manualpurgefor control

Manual Low-Pressure Diaphragm Valve LD SERIES — UHP High-Temperature, Zero-Dead-Volume

Product application and purpose
The LD SERIES manual low-pressure diaphragm valve is designed for ultra-high-purity (UHP) vacuum and low-pressure vapor delivery lines in semiconductor manufacturing, specifically for heated lines used in processes such as CVD and ALD. It provides positive manual isolation while preventing virtual leaks that can affect sub-nanometer wafer processing.

Eliminating virtual leaks by design

• Zero-dead-volume architecture: Streamlined internal wetted cavity with no hidden pockets to eliminate molecule entrapment.
• High-temperature material selection: Wetted components in 316L VIM-VAR stainless steel and diaphragms in Hastelloy C-22 or cobalt-based superalloys (UNS R30003) maintain integrity under continuous heating.
• Electropolished internal finish: Internal surfaces electropolished to < 5 micro-inches Ra to reduce adsorption and speed desorption during purge and pump-down cycles.

Installation and maintenance guidelines
Unpack double-sealed components inside a certified Class 100 cleanroom. Fit the valve using orbital butt-weld or VCR face-seal connections as recommended. When using heat jackets, ensure even coverage and do not exceed the valve maximum rated temperature. Perform vacuum decay tests and helium mass spectrometer leak checks to verify baseline integrity before process start-up.

LD SERIES
LOW PRESSURE MANUAL DIAPHRAGM VALVE

Features
Body

• 316L VIM-VAR stainless steel body for ultrahigh-purity applications.
• Inner surface roughness achievable to < 5 μin Ra and fully cleanable flow channel.
• Minimized entrapment areas to facilitate purging and maximize flow capacity.

Diaphragm

• Hastelloy C-22 or cobalt-based superalloys (UNS R30003) for temperature and corrosion resistance.
• Engineered for extended cycle life.

Seat

• Fully contained PCTFE seat design to resist swelling and contamination.
• Improved helium leak test performance and minimal particle generation.
• Assembled and packaged in high-cleanliness conditions; helium tested prior to shipment.

Technical data
Reference technical illustrations and dimensional drawings are available (dimensions in millimeters; subject to change).

Product size
Dimensions are provided for reference and may be updated.

Flow channel form
Streamlined flow channel to minimize entrapment and maximize purge efficiency.

Ordering information
Multiple configurations and standard ordering specifications are available for the LD SERIES family.

Specifications

• Model / Series: LD SERIES
• Application: UHP vacuum and low-pressure vapor lines for semiconductor processes (CVD, ALD)
• Body material: 316L VIM-VAR stainless steel
• Internal finish: Electropolished to < 5 micro-inches Ra
• Diaphragm materials: Hastelloy C-22 or cobalt-based superalloys (UNS R30003)
• Seat material/design: Fully contained PCTFE seat
• Architecture: Zero-dead-volume internal wetted cavity
• Cleanroom handling: Double-sealed packaging; suitable for Class 100 unpacking and high-cleanliness assembly
• Connection options: Orbital butt-weld or VCR face-seal (recommended)
• Testing: Vacuum decay and helium mass spectrometer leak checks; helium testing before shipment
• Operational notes: Designed for heated gas lines; ensure even heat-jacket coverage and do not exceed maximum rated temperature