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Heat treatment oven VF-5700
oxidationcabinetelectric

heat treatment oven
heat treatment oven
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Characteristics

Function
heat treatment, oxidation
Configuration
cabinet
Heat source
electric
Other characteristics
for aeronautical applications
Width

1,250 mm
(49.21 in)

Height

2,850 mm
(112.2 in)

Depth

2,000 mm
(78.74 in)

Description

This heat treatment system performs silicon wafer, IGBT, polyimide and thin wafer oxidation, diffusion and CVD. Since its height is less than 3000 mm, this model can be easily introduced. It features a short cycle time and high throughput. Features Mini batch, flexible 25 to 50 wafers batch processing High throughput using a high-power heater with fast heat-up time Equipped with an operator-friendly high performance control system Compact size without stocker This short cycle time, high throughput, vertical diffusion furnace processes 300-mm (12-inch) wafers in a mini batch of 25–50 wafers each. Since the stocker space is eliminated, its height is less than 3000 mm, making it easy to introduce. There are many cases where furnaces are introduced without stockers, so you can cut the stocker-related costs. Thanks to the LGO heater, the furnace exhibits superior temperature characteristics over a wide range from low to medium high temperatures. It is suitable for the heat treatment of IGBT, polyimide, thin wafers and other materials in addition to silicon wafers.
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.