Annealing furnace VFS-4000

diffusionbakingcabinet

This large-bore vertical furnace for 4.5G/5.5G was developed by making use of semiconductor manufacturing equipment technologies for glass substrate manufacturing. This furnace is suitable for low-compaction organic EL (OLED/AMOLED) frit sealing processes and dewatering. Features The semiconductor diffusion furnace has been modified to a larger scale for the flat panel display Normal pressure processing and decompression processing are possible Various kinds of gas atmospheres (oxidization, reduction, neutral, corrosion, etc.) Max substrate size:1300 × 1500 mm Large-scale LGO heater has excellent temperature characteristics This large-bore vertical furnace employs strict temperature characteristic control, atmosphere control and particle control, expertise for semiconductor manufacturing, for FPD. Quartz boats are used to create a low-particle, metal-free environment to enable vacuum heat treatment at 10 ppm or lower O2 concentration. This furnace is suitable for touch panel and other material contact annealing, post-baking and activation annealing.