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Baking oven CLH Seriesagingannealingchamber

baking oven
baking oven
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Characteristics

Function
baking, aging, annealing
Configuration
chamber
Other characteristics
high-temperature
Maximum temperature

450 °C, 500 °C, 530 °C (842 °F)

Description

High-temperature baking in a clean environment is enabled by the heat-resistant high-performance filter and unique cooling unit. A hot-air circulation system is used to highly accurately carry out wafer and glass substrate baking/aging, polyimide curing and annealing. Features A heat-resistant high-performance filter and our unique cooling unit are installed to enable high-temperature baking. The chamber interior can maintain class 100 cleanliness when the temperature is stable. There are 2 hot-air blower types: front side blower with horizontal circulation (type V) and side blower (type III). Both achieve high thermal efficiency and good temperature uniformity. This type of oven is optimal for semiconductor wafer and glass substrate baking, aging and other heat treatments requiring high accuracy. Inert gases can be introduced into the chambers to use the ovens as inert gas ovens.
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.