A vertical furnace enabling high-temperature processing, ideal for power device manufacturing. Supports oxynitriding and wafers of up to 8 inches in size. Features an automatic wafer transfer mechanism, and can be used for applications ranging from R&D to mass production.
Features
Supports lot sizes ranging from mini-batches to 50 wafers, and applications ranging from R&D to use on mass-production lines.
Supports a wide range of wafer sizes up to 8 inches.
Enables temperature monitoring in wafer vicinity.
The furnace interior features our proprietary metal-free construction.
Supports serial processing of different oxidizing/oxynitriding processes (wet/dry oxidizing, H2 annealing, NH3 nitriding, NO/N2O oxynitriding).
Chamber cleaning mechanism (option)