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Annealing furnace VF-5300HLP
chamberhigh-temperaturevertical

annealing furnace
annealing furnace
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Characteristics

Function
annealing
Configuration
chamber
Other characteristics
high-temperature, automatic, vertical
Maximum temperature

Min.: 700 °C
(1,292 °F)

Max.: 1,900 °C
(3,452 °F)

Description

A vertical furnace enabling ultra high-temperature processing, ideal for power device manufacturing. Supports 6- to 8-inch wafers and has an automatic wafer transfer mechanism. Can be used for mass production. Features Supports Max.100 wafers per lot, and use on mass-production lines. Supports a wide range of wafer sizes from 6 to 8 inches. The furnace interior features our proprietary metal-free construction. Enables temperature monitoring in wafer vicinity. An N2 load lock is provided as a standard feature. High-throughput cassette-to-cassette transport H2 atmosphere annealing with trench rounding is available as an option. VF-5300HLP is a vertical furnace that can process a maximum of 100 wafers per lot, and a wide range of wafer sizes from 6 to 8 inches. Carefully selected hardware and control system features enable use on mass-production lines. The furnace interior features our proprietary metal-free construction. VF-5300HLP supports ultra high-temperature activation annealing processes.
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.