A vertical furnace enabling ultra high-temperature processing, ideal for power device manufacturing. Supports 6- to 8-inch wafers and has an automatic wafer transfer mechanism. Can be used for mass production.
Features
Supports Max.100 wafers per lot, and use on mass-production lines.
Supports a wide range of wafer sizes from 6 to 8 inches.
The furnace interior features our proprietary metal-free construction.
Enables temperature monitoring in wafer vicinity.
An N2 load lock is provided as a standard feature.
High-throughput cassette-to-cassette transport
H2 atmosphere annealing with trench rounding is available as an option.
VF-5300HLP is a vertical furnace that can process a maximum of 100 wafers per lot, and a wide range of wafer sizes from 6 to 8 inches. Carefully selected hardware and control system features enable use on mass-production lines. The furnace interior features our proprietary metal-free construction. VF-5300HLP supports ultra high-temperature activation annealing processes.