UV laser marking machine PE-UV-3D
3D lasermetalfor electronic components

UV laser marking machine
UV laser marking machine
UV laser marking machine
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UV laser, 3D laser
for electronic components, industrial, for PCB, cable, for pipe, for aluminum profiles, for wire, for pens
Other characteristics
compact, high-speed, continuous

Min.: 3 W
(0 hp)

Max.: 5 W
(0.01 hp)

X travel

Min.: 110 mm
(4 in)

Max.: 300 mm
(12 in)

110 mm
(4 in)

Y travel

Min.: 110 mm
(4 in)

Max.: 200 mm
(8 in)

110 mm
(4 in)


The 3D dynamic uv laser marking machine is one of the series of laser marking machines, but it is developed with 355nm UV laser. The uv laser marking machine uses intracavity frequency doubling technology compared with infrared laser. The 355 UV focusing spot is very small and can greatly reduce the mechanical deformation of materials and have little influence on processing heat. Because the uv laser marking machine is mainly used for ultra-fine marking and engraving, it is especially suitable for high-speed division of food, medical packaging materials, micropores, glass materials, and complex graphic cutting of silicon wafers. The uv laser marking machine adopts imported core components and is equipped with high-speed and high-precision 3D galvanometer. Combined with the 3D special software and control system independently developed by our company, it can perfectly realize the fine processing of any curved surface workpiece without the focus phenomenon; The uv laser marker can also be used for deep engraving. The focus tracking in real time makes the processing efficiency and quality better than the traditional 2D marking machine. Realize the full realization of 3D marking function, leading laser processing into a new era. The three-dimensional UV laser machine adopts imported high-quality ultraviolet laser source. The 355nm uv light focuses on the spot, and the processing heat affected zone is very small. It is suitable for processing materials with large thermal radiation response. The uv laser marking machine is mainly used for superfine marking and special material marking,carving and cutting. Widely used in the high-end market of ultra-fine laser processing.


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