Diamond wire cutting machine GC-CQ1660UH

multi-wirefor metalsheet

Product Introduction
This machine is a specialized diamond-wire multi-wire cutting machine for magnetic materials, designed for stable high-speed cutting of thin magnetic sheets and continuous production reliability.

Core product features

• Core components such as the machine bed are manufactured by casting; rollers use a double-cone positioning structure combined with servo motor synchronous direct-drive technology to enhance spindle rigidity and stability at high speed.
• Ultra-high wire speed capability: stable cutting at up to 2600 m/min, improving throughput for thin-wire cutting.
• Power-off slow-stop function reduces the risk of wire breakage during sudden power loss, ensuring production continuity.
• Equipped with an energy recovery module to recover braking energy from roller reciprocation, reducing operational power consumption.
• Strong diamond-wire thinning capability, suitable for processing thin sheet products.

Product Parameters
Item | Unit | Parameter
Max. processing size | mm | 160(W)×600(L)×160(H) × Double-Station
Slice thickness | mm | 1–20
Max. wire speed | m/min | 2600
Feeding direction | - | Vertical upward
Feeding speed | mm/min | 0.1–9
Wire diameter | mm | 0.08–0.25
Maximum Wire Storage Capacity | km | 50 (0.10 diamond wire)
Equipment dimensions | mm | Approx. 3000(L)×1800(W)×2900(H)
Equipment Weight | t | Approx. 10

Features / Technical specifications

• Model: GC-CQ1660UH
• Applicable material: Magnetic materials (diamond-wire specialized)
• Max. processing size: 160(W)×600(L)×160(H) (Double-Station)
• Slice thickness range: 1–20 mm
• Max. wire speed: 2600 m/min
• Feeding direction: Vertical upward
• Feeding speed: 0.1–9 mm/min
• Wire diameter: 0.08–0.25 mm
• Maximum wire storage capacity: 50 km (based on 0.10 mm diamond wire)
• Equipment dimensions (approx.): 3000×1800×2900 mm (L×W×H)
• Equipment weight (approx.): 10 t
• Key functions: Double-cone roller positioning, servo synchronous direct drive, power-off slow-stop, energy recovery, strong thin-wire processing capability