Surface mounted housing

rectangularsquareceramic

Complete ceramic housing solutions provide hermetic, thermally efficient and highly reliable enclosures tailored for optical communication, power devices, military/aerospace systems and automotive electronics. These ceramic packages are designed to operate in high-temperature and harsh environments, offering excellent dielectric properties, hermetic sealing and customizable structures to fit specific device characteristics and operating conditions.

Representative product series:

• Ceramic Small Outline Package (CSOP)
  Miniature surface-mount package with gull-wing leads. Lead pitch options: 1.27 mm, 1.00 mm and 0.80 mm.
  
  • Features:
    
    • Miniaturized design with gull-wing leads minimizing stress
    • Excellent resistance to mechanical shock
    • Multiple lead pitches available: 1.27 mm, 1.00 mm, 0.80 mm
  • Applications:
    
    • Various integrated circuits
    • High-reliability component packaging
• Ceramic Surface-Mount Power Package (SMD)
  Designed for power devices and high-heat-flux components to provide extremely low thermal resistance pathways and excellent thermal contact surfaces.
  
  • Features:
    
    • High current-carrying capability
    • Large chip bonding area serving as an efficient heat sink
    • Reliable performance with superior thermal management
  • Applications:
    
    • Microwave device housings
    • Crystal and oscillator device packages
• Ceramic Dual In-line Package (CDIP)
  Widely used through-hole package composed of two pressed ceramic blocks enclosing a dual in-line lead frame. Standard lead pitch typically 2.54 mm; lead counts from 6 to 64.
  
  • Features:
    
    • Dual in-line lead configuration
    • Wide range of lead counts
  • Applications:
    
    • Integrated circuits with moderate pin-out and assembly density requirements
    • Optocouplers, MEMS devices and other high-reliability components
• Ceramic Leadless Quad Packages (CLCC / CQFN)
  Leadless/no-exposed-lead quad packages ideal for high-frequency, low-parasitic inductance applications and efficient thermal dissipation.
  
  • Features:
    
    • Low parasitic parameters with compact size
    • Excellent thermal management and high reliability
    • Available in dual-side or four-side lead configurations
    • Multiple lead pitch options, e.g. 1.27 mm, 1.00 mm, 0.50 mm
  • Applications:
    
    • High-density surface-mount applications
    • VLSI, ASIC and ECL circuits
• Laser SMD Ceramic Packages
  Packages for laser devices that encapsulate light-emitting/receiving chips while transmitting optical signals and managing heat to maintain wavelength stability and consistent output power.
  
  • Features:
    
    • High thermal conductivity with excellent chip protection
    • Stable performance and reliable driving capability
    • Compact 7 mm surface-mount design with built-in safety features
    • Enables long projection distances, narrow beam angles and small optical dimensions
  • Applications:
    
    • Portable exploration and rescue lighting
    • Automotive and architectural lighting
    • Outdoor and entertainment lighting
• Optical Communication Package Series (ROSA / TOSA, etc.)
  ROSA (Receiver Optical Sub-Assembly) and TOSA (Transmitter Optical Sub-Assembly) for optoelectronic modules (e.g., SFP/QSFP), housing laser diodes, photodiodes and fiber coupling windows with hermetic window sealing and excellent thermal control.
  
  • Features:
    
    • High hermeticity with extremely low leakage
    • Excellent thermal management for extended service life
    • Supports wide range of data rates (from 10 GHz to 400 GHz)
    • Customizable designs to meet specific requirements
  • Applications:
    
    • Fiber-optic communication systems
    • Optoelectronic transmitter and receiver modules
    • Optical switches, modules and high-power laser systems

Technical characteristics / specifications:

• Typical package materials referenced: alumina (Al2O3), aluminum nitride (AlN), beryllium oxide (BeO) — used as housing/substrate materials in ceramic packaging
• CSOP lead pitches: 1.27 mm, 1.00 mm, 0.80 mm
• CDIP standard lead pitch: 2.54 mm; lead counts typically 6 to 64
• CLCC / CQFN available lead pitches include: 1.27 mm, 1.00 mm, 0.50 mm
• Laser SMD: compact 7 mm surface-mount format (surface-mount laser packages)
• Optical packages (ROSA/TOSA): hermetic sealing, thermal management to support data rates from 10 GHz up to 400 GHz
• Key functional advantages: excellent thermal performance, low dielectric loss, hermetic sealing capability, high reliability in high-temperature and harsh environments
• Company offering: one-stop ceramic packaging services from material selection, ceramic processing, metallization and sealing to hermeticity and reliability testing, prototyping and mass production