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Ceramic packaging is the “case” that uses ceramic materials (like alumina, aluminum nitride, or beryllium oxide) as the housing or substrate for integrated circuits. It’s a protective enclosure or base that prevents the semiconductor chip from environmental damage and provides electrical connections to the outside world.PropertyValue92F93DColor––BlackWhiteAl2O3 Content–%9293Density25℃g/cm33.73.65Thermal Conductivity25℃W/(m· K)2018Coefficient of Linear Thermal Expansion40℃~400℃x10-6/℃6.7740℃~800℃6.97.2Volume Resistance20℃Ω·cm10141014300℃10101010500℃108109Dielectric Constant1MHZ–109Dielectric Loss1MHZx10-444Flexural Strength0.5mm/minMPa400400Ceramic packaging shells come in various structural forms depending on the characteristics and operating environments of different devices.1. Ceramic Small Outline Package (CSOP)Features:Compact size, wing-shaped leads, low stressExcellent resistance to mechanical shockMultiple lead pitches: 1.27mm, 1.00mm, 0.80mm, etc.Applications:IC packagingHigh-reliability component packaging for space, radiation, or military/defense applications2. Surface-Mount Device package (SMD)Features:High electrical conductivity and current-carrying capacityLarge-area heat sink for the chip bonding zoneReliable performance and excellent thermal dissipationApplications:Microwave device housingCrystal oscillator housing3. Ceramic Dual in-line Package (CDIP)Features:Dual in-line packageWide range of pin countsEMI/RFI ProtectionApplications:Programmable Logic Device, LSIOptocouplers, MEMS devices, etc.4. Ceramic Leadless Chip Carrier/Ceramic Quad Flat Non-leaded Package (CLCC/CQFN)Features:Low parasitic parameters and compact sizeExcellent heat dissipation and high reliabilityAvailable in dual-sided and quad-sided lead configurationsMultiple lead pitches: 1.27mm, 1.00mm, 0.50mm, etc.Applications:Suitable for high-density surface mountingVLSI, ASIC, and ECL circuits5. Laser SMD packageFeatures:High thermal conductivity, superior crystal protectionStable performance and driving powerCompact surface-mount device 7mm combined with built-in safetyEnables ultra-long projection distances, narrow beam angles, and compact optical sizesApplications:Portable Search and Rescue LightingAutomotive and Construction LightingOutdoor and entertainment Lighting6. Laser SMD packaFeatures:High airtightness and reliabilityMeets speed requirements from 10 GHz to 400 GHz in various applicationsCustomizable development availableApplications:Fiber optic communicationsOptoelectronic transmitters and receiversOptical switches and modules, High-power lasersInnovacera offers one-stop ceramic packaging solutions, ranging from standard parts to fully customized designs. For ceramic package housings, please feel free to contact us.Technical Specifications:Material: Alumina, Aluminum Nitride, Beryllium OxideAl2O3 Content: 92% (92F), 93% (93D)Density: 3.7 g/cm³ (92F), 3.65 g/cm³ (93D)Thermal Conductivity: 20 W/(m·K) (92F), 18 W/(m·K) (93D)Volume Resistance: 1014 Ω·cm (20℃)Dielectric Constant: 10 (92F), 9 (93D) at 1MHzFlexural Strength: 400 MPa