Telephone line packaging

for industrial applicationsfor the electronics industryfor electrical components

Description
Hermetic optoelectronic packages provide a sealed mechanical and thermal interface for photonic and optoelectronic components. We offer end-to-end packaging from design and prototyping to pilot runs and mass production, with selectable metal, HTCC and LTCC shells to meet optical, thermal and environmental requirements for telecom, LiDAR, medical imaging and power electronics.

Products

• Metal packaging
• Metal shells use glass-to-metal and ceramic-to-metal interfaces to create sealed housings that stabilize the chip environment and enable efficient heat dissipation. They protect devices from humidity, temperature cycling and corrosive environments. Typical uses: base station radar modules, electronic countermeasure units, measurement & control instruments, and signal power supplies.

Technical advantages (Metal packaging)

• Compatible materials: Kovar, carbon steel, stainless steel, tungsten–copper, aluminum alloys
• Supported sealing/welding: energy-storage welding, parallel seam welding, tin soldering, laser seam sealing
• Insulation resistance ≥ 5000 MΩ (measured at 500 V DC)
• Air tightness (He): R1 ≤ 1×10⁻³ Pa·cm³/s
• Salt spray resistance: configurable to 24 h / 48 h / 72 h corrosion tests
• Full industrial chain from R&D and design to production; customizable services available

Product models

• Signal processing device housings
• Power module packages
• Motor drive and PWM packages
• Ceramic packages for discrete semiconductor devices
• Replay/return packages
• Lids and caps
• Power surface-mount packages

HTCC ceramic package shells

• Ceramic Dual In-line Package (CDIP)
• Ceramic Flat Pack / Ceramic Quad Flat Pack (CFP / CQFP)
• Ceramic Quad Flat Non-leaded Package (CQFN)
• Ceramic Pin Grid Array (CPGA)
• Ceramic Small Outline Package (CSOP)
• Ceramic Leadless Chip Carrier (CLCC)

Technical advantages (HTCC)

• Self-controlled plating process
• Advanced design and simulation to optimize shell/substrate structure, routing, thermal behavior and reliability
• Complete industry-chain capabilities with customization options

LTCC ceramic package shells
LTCC (Low Temperature Co-fired Ceramic) substrates combine alumina and glass with high-conductivity conductor pastes (gold, silver, copper) co-fired at ~850–900°C. LTCC shells are suited to RF, microwave and millimeter-wave device packaging due to low conductor resistivity and low dielectric constant.

Technical advantages (LTCC)

• Minimum trace width/spacing: 100 µm
• Minimum via/aperture: 100 µm
• Minimum hole spacing: 2.5 × aperture
• Up to 40 functional layers
• Available product classes: high-frequency low-loss and high-strength

Material system
Base materials performance

• Iron–nickel–cobalt alloy | 4J29 | Density 8.2 g/cm³ | CTE 5.3 ×10⁻⁶/°C (20–300°C) | TC 17 W/m·K
• Nickel–iron alloy | 4J42 | Density 7.12 g/cm³ | CTE 4.8 ×10⁻⁶/°C | TC 13 W/m·K
• Plain carbon steel | 10# | Density 7.8 g/cm³ | CTE 13.0 ×10⁻⁶/°C | TC 46 W/m·K
• OFHC (TU1) | TU1 | Density 8.9 g/cm³ | CTE 17.6 ×10⁻⁶/°C | TC ≈ 390 W/m·K
• W/Cu | WCu85/15 | Density 16.4 g/cm³ | CTE 7.2 ×10⁻⁶/°C | TC ≈ 180 W/m·K
• Stainless steel | 304 / 316 | Density 7.93 / 7.98 g/cm³ | CTE 17.2 / 20 ×10⁻⁶/°C | TC 16 / 16.29 W/m·K

Pin materials performance

• Iron–nickel–cobalt alloy | 4J29 | Resistivity 48 µΩ·cm | CTE 5.3 ×10⁻⁶/°C
• Nickel–iron alloy | 4J50 | Resistivity 43 µΩ·cm | CTE 9.5 ×10⁻⁶/°C
• Cu-cored 52 alloy | 4J50 | Resistivity 12 µΩ·cm | CTE 11.5 ×10⁻⁶/°C
• Copper alloy (Tul) | Tul | Resistivity 1.7 µΩ·cm | CTE 17.6 ×10⁻⁶/°C

Typical applications

• High-power laser TO packages
• Automotive relay sealing
• Discrete semiconductor device packaging
• Multilayer ceramic substrates (MCM / MLC)
• Surface-mount power packages
• Optical communications: 400G transceiver hermetic sealing
• Automotive electronics: LiDAR emitter packaging for autonomous driving
• New energy: insulation terminals for battery management systems (BMS)

Technical specifications

• Insulation resistance: ≥ 5000 MΩ (measured at 500 V DC)
• Air tightness (helium): R1 ≤ 1×10⁻³ Pa·cm³/s
• Salt spray corrosion resistance: configurable to meet 24 h / 48 h / 72 h tests
• Supported metal packaging materials: Kovar, carbon steel, stainless steel, tungsten–copper, aluminum alloy
• Supported welding/sealing methods: energy-storage welding, parallel seam welding, tin soldering, laser seam sealing
• HTCC package types: CDIP, CFP/CQFP, CQFN, CPGA, CSOP, CLCC
• LTCC capabilities: min trace/spacing 100 µm, min via/aperture 100 µm, min hole spacing 2.5×aperture, up to 40 layers, product options for HF low-loss and high-strength
• Representative thermal conductivity: OFHC (TU1) ≈ 390 W/m·K; WCu85/15 ≈ 180 W/m·K