Rectangular housing CSOP

squareceramicelectronics

The Ceramic Small Outline Package (CSOP) is a high-reliability ceramic IC packaging solution designed for miniaturized electronic systems that require mechanical strength, thermal stability and stable electrical performance. Manufactured by advanced ceramic processing and precision metallization, CSOP packages protect integrated circuits and provide reliable interconnections for demanding environments.

Key features

• Miniaturization enabled by wing-shaped leads that reduce mechanical stress on solder joints.
• High resistance to mechanical shock and vibration for high-reliability assemblies.
• High dimensional accuracy and stable metallization for reliable interconnections.
• Suitable for high-density PCB assembly.
• Multiple lead pitches available (examples: 1.27 mm, 1.00 mm, 0.80 mm, 0.65 mm, 2.54 mm).

Applications

• Packaging of a wide range of integrated circuits (ICs).
• High-reliability electronics for aerospace and defense.
• Industrial control and automation systems.
• Medical devices and precision instrumentation.

Technical specifications (summary)

• External structure
  
  • Length (L): 5 – 75 mm (tolerance ±1%); special dims 2 – 100 mm (±0.6%).
  • Width (W): 5 – 75 mm (tolerance ±1%); special dims 2 – 100 mm (±0.6%).
  • Thickness (H): 0.8 – 4.0 mm (tolerance ±3%); special dims 0.4 – 5.0 mm (±2%).
  • Single-layer thickness (h): available 0.12, 0.15, 0.20, 0.25 mm (±0.02); special 0.10 mm (±0.01).
• Internal structure
  
  • Hole diameter (Φp1): 0.13, 0.17, 0.20, 0.25, 0.30, 0.34, 0.42 mm (±0.01); also 0.08, 0.10 mm (±0.01).
  • Hole spacing (s1): minimum 3·Φp1.
  • Distance from hole to edge (s2): minimum 3·Φp1.
  • Pad (Φp2): Φp1 + 0.1 mm (or Φp1 + 0.05 mm for special dims).
  • Side hole radius (R): 0.17, 0.21, 0.25, 0.30 mm.
  • Hole spacing (s3): minimum 3·R.
  • Via position deviation (s4): ±0.02 (standard); ±0.015 (special).
• Metallization
  
  • Line width (A): minimum 0.08 mm (±20%); special min 0.05 mm (±10%).
  • Line width >0.10 mm: tolerance ±0.02 (standard); special ±0.01.
  • Line spacing (B): minimum 0.08 mm (±20%); special min 0.05 mm (±0.01).
  • Line spacing >0.10 mm: tolerance ±0.02.
  • Distance from pattern to edge (C): minimum 0.20 mm (standard); special 0.00 mm.

Standard product models

• CSOP04-01 — Leads: 4; Lead pitch: 2.54 mm; Cavity: 2.60 × 2.30 mm; External: 5.40 × 4.00 mm; Sealing: Flat.
• CSOP08-02 — Leads: 8; Lead pitch: 1.27 mm; Cavity: 2.74 × 3.00 mm; External: 5.00 × 4.40 mm; Sealing: Flat.
• CSOP14-03 — Leads: 14; Lead pitch: 1.27 mm; Cavity: 4.50 × 2.40 mm; External: 9.00 × 6.00 mm; Sealing: Flat.
• CSOP16-02 — Leads: 16; Lead pitch: 1.27 mm; Cavity: 1.60 × 2.20 mm; External: 10.50 × 5.40 mm; Sealing: Flat.
• CSOP16D — Leads: 16; Lead pitch: 1.27 mm; Cavity: 5.00 × 3.00 mm; External: 10.50 × 7.50 mm; Sealing: Flat.
• CSOP20-01 — Leads: 20; Lead pitch: 1.27 mm; Cavity: 6.00 × 4.00 mm; External: 12.70 × 7.50 mm; Sealing: Flat.
• CSOP20-02 — Leads: 20; Lead pitch: 0.65 mm; Cavity: 2.80 × 2.80 mm; External: 6.60 × 5.50 mm; Sealing: Flat.
• CSOP24-03H — Leads: 24; Lead pitch: 0.65 mm; Cavity: 4.60 × 2.00 mm; External: 8.60 × 6.30 mm; Sealing: Flat.
• CSOP32-02 — Leads: 32; Lead pitch: 1.27 mm; Cavity: 12.00 × 9.70 mm; External: 20.47 × 12.70 mm; Sealing: Flat.
• CSOP56-01 — Leads: 56; Lead pitch: 0.80 mm; Cavity: 10.80 × 10.30 mm; External: 27.30 × 13.30 mm; Sealing: Flat.