- Robotics - Automation - Industrial IT >
- Industrial Computing >
- Edge computing computer-on-module >
- SECO
SECO edge computing computer-on-modules
{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
SMARC® Rel. 2.1.1 computer-on-moduleSOM-SMARC-QCS6490
Memory size: 0 GB - 12 GB
... SMARC® 2.1.1 module powered by Qualcomm® QCS6490 processor Video Resolution - Primary display: FHD+ @120 fps Secondary display: up to 4k Ultra HD @60Hz Audio 2x I2S Serial Ports 2x UART (RX/TX/RTS/CTS), 2x UART (RX/TX) Other Interfaces 2C Ultra ...
SECO
Memory size: 12 GB
... SMARC® 2.1.1 module with Qualcomm® QCS5430 processor Cpu 2x Arm® Cortex®-A78 @2.4 GHz, 4x Arm® Cortex®-A55 Memory Soldered-down LPDDR5-6400 memory, up to 12GB total, 32-bit interface 2 channels Graphics Qualcomm® Adreno™ 642L Video Interfaces LVDS ...
SECO
Memory size: 0 GB - 32 GB
... and requires a compatible carrier board for full I/O access. Target applications include industrial
edge
computing, HMI, vision and AI inference at the
edge.
Technical specifications
- Description:
SECO
SMARC 2.1 computer-on-moduleSOM-SMARC-TWL
Memory size: 0 GB - 16 GB
... Overview
SMARC® Rel. 2.1 module (E08) featuring Intel® Core™ i3 and Intel® Processors N Series (codename Twin Lake). Compact 50 x 82 mm form factor tailored for industrial embedded applications; LPDDR5 soldered memory and broad I/O options.
Highlights
- CPU
SECO
Memory size: 0 GB - 32 GB
... 6 basic module SOM-COMe-BT6-RK3588 integrating Rockchip RK3588 SoC and an on-board Axelera Metis AIPU (up to 120 TOPS) for
edge AI, multimedia and industrial embedded applications.
Highlights
- CPU: Rockchip
SECO
Memory size: 0 GB - 16 GB
... C1
Recommended applications
- Embedded controllers, industrial automation and HMI
- Edge computing, digital signage and vision systems
- Transportation, building automation and
SECO
Memory size: 0 GB - 96 GB
... Overview
COM Express® 3.1 Type 6 Compact Module SOM-COMe-CT6-P100 featuring AMD Ryzen™ AI Embedded P100 Series processors. Compact 95 x 95 mm module designed for embedded applications requiring AI acceleration, multimedia and extensive I/O options.
Highlights
- CPU
SECO
Memory size: 0 GB - 96 GB
... module featuring Intel® Core™ Ultra Series 3 processors (codename: Panther Lake-H), designed for high-performance embedded and
edge systems requiring AI acceleration, multi-display support and extensive I/O.
Highlights
- CPU:
SECO
Memory size: 0 GB - 16 GB
... Applications Processors, delivering optimized processing and advanced Machine Learning acceleration for next-generation edge computing applications. Graphics - GPU Arm Mali-G310 V2 with 2D/3D acceleration Audio 1x ...
SECO
Memory size: 0 GB - 96 GB
... Product overview
COM Express Rel. 3.1 Type 6 module SOM-COMe-BT6-PTL based on Intel® Core™ Ultra Series 3 processors (codename: Panther Lake-H). Designed for embedded systems requiring high compute, integrated graphics, on-board AI acceleration ...
SECO
Subscribe to our newsletter
Receive updates on this section every two weeks.
Please refer to our Privacy Policy for details on how DirectIndustry processes your personal data.
- Brand list
- Manufacturer account
- Buyer account
- Our services
- Newsletter subscription
- About VirtualExpo Group