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High-speed Double Flyer Armature Winding Machine
Displayed Machine : HDF-0160
HDF-0160 is a coil winding machine for variously shaped armature coils.
HDF-0160 utilizes NITTOKU`s original controller as well as the newest servomotors. In addition to the compact and simple mechanism of the machine, remarkably easy and flexible specification changes can be performed with NC 11 axes control.
Features :
. Easy specification change
. NC controlled formers. Core indexing possible in very narrow space
. No scrap wire
. Mono-block cast body for high stability and longevity
HDF-0160 is the High-speed version of coil winder DF-0150.
NITTOKU offers a range of further Armature Winding machines. For small-lot production and high variety of specifications consider the KIO-0150.
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The XE-WAFER is a fully automated industrial AFM designed specifically to address surface roughness, trench width, depth and angle measurements on 200mm & 300mm wafers in a production environment. The system provides superior accuracy and precision nanometrology than any in the market today. Providing the highest resolution and the lowest gage sigma value imaginable for repeatability and reproducibility in the world, the XE-WAFER is the perfect solution for the semiconductor and hard disk drive industry which, until now, had very limited choice of industrial grade in-line inspection tools. We, Park Systems, take pride in providing you with the metrology solution you have been longing for.
- Allowable Sample Size (Up to 300mm Wafers)
- Allowable Scan Size (100 μm x 100 μm, Optional: 200 μm x 200 μm)
- Automatic Data Acquisition & Analysis of High Aspect Ratio Trench Features on Wafers
- Acoustic Enclosure with Built-in Anti Vibration Isolation System
- Designed Specifically for Production Facilities
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Satellite Paste Applicators are designed to complement an existing heat source, such as furnace or induction. These freestanding units apply single, multiple, or "ring shape" paste deposits onto assemblies. Cycling is automatic and error-free with an operator removing the pasted part and loading it into the adjoining heat source.
Applicator guns can also be mounted to a robot to apply a detailed combination of paste dots and stripes to a particular part. After the pasting cycle, the part is joined to its companion members and fixtured to the subsequent heating and cooling sequence.
Dual station system utilizes rotating mandrel technique to apply 360° stripe of Fusion Paste onto part joint area.
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SPECIAL
This product line gathers all automated or semi-automated systems, designed and built for complete or partial applications, on specific request for custom equipment, syandalone or integrated.
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CNC Controlled Automatic Coil Winder
AN 240 / 480 / 720 Series
AN 240 / 480 / 720 series are excellent winding machines in versatility that can be widely used for variously-shaped bobbin winding types such as relays, solenoids, ignition coils, and others.
Optionally AN series winders can be equipped with
. Double Traverse mechanism
. Direct Spindle drive
. Quick mount / disconnect type jig holder
for substantially higher production, even more accuracy, reduced running cost and less noise.
NITTOKU`s tool transfer system vastly reduces down-time for specification changeovers. It`s modular system permits addition / removal of processing modules for soldering, taping or assembling to / from a full-range system line.
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ND-RX01 Multi-tap wire array automatic winding machine
Technical Data:
Diameter of Wire: 0.1-1.2mm
Wire amplitude: 0-30mm
Winding Diameter 25-180mm
Effective distance between winding shafts: 550mm-700mm
Winding tooling distance: 210mm-280mm
Rotation speed: 3200R.P.M
Input: 220V/50Hz
Air pressure: 0.5-0.8MPa
Power: 750W
Machine productivity: around 1500 pcs/8 hours
Dimension: 1450mm × 912mm × 1200mm
Weight: ≈ 800kg
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Sinergo as a result of hard work and daily study of the most varied welding applications makes completes assembling, welding, testing and marking systems, art the customer's specific request. The designing and manufactoring of both software and electronic-mechanical components are carried out by Sinergo itself.
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The S790VXI Series2 represents the ultimate high-performance, mixed signal ATE system. Its advanced hardware technology, coupled with CATE software for fast effective program production, makes the S790 Series2 the ideal solution for addressing today's major board test concerns - test program generation,and diagnostic speed and accuracy.
Protecting your investment - with complete S700-series backward compatibility. Fully compatible with all Schlumberger S700 test systems, the S790 Series2 provides a complete, riskfree migration path for all S700 series test programs.
Protecting large investments into earlier S700 test programs and fixtures is, for most users, a major concern. The S790 Series2 protects your investment; its compatible architecture allows existing test programs and fixtures to be loaded and run - simply and robustly - providing an assured, risk-free migration path.
All diagnostic data is also ported, avoiding lengthy and costly revalidation of new or modified diagnostics
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FC150: The Most Flexible High Accuracy Die Bonder
With ± 0.5 µm placement accuracy and ± 1 µm post-bond accuracy, the SET FC150 Die/Flip Chip Bonder offers the latest evolutions in bonding techniques. With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. The high degree of flexibility offered on the FC150 makes it the machine of choice for advanced research with the ability to move directly into pilot production.
Available as a fully automated system to level, align and bond components ranging in size from 0.2 to 100 mm, the FC150 supports a complete range of bonding applications, including Reflow, Thermo-compression, Thermosonic, Adhesives and Fusion bonding.
Designed to maximize accuracy and versatility, the FC150 answers almost every need in high-end bonding applications.
The FC150 accommodates a wide variety of processes and materials, including extremely fragile materials such as GaAs and HgCdTe. Active leveling is made possible through a motorized pitch & roll system combined with autocollimation or laser leveling. Bond process changes are easily achieved.
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Panasonic's DMX is a world-class, high-productivity die bonder supporting 200mm and 300mm wafers. The eight-nozzle head system offers unparalleled productivity, providing results that are nearly 300% greater than conventional die bonders. The 3-beam mechanism and multi-nozzle bond head provide substrate recognition and both pre- and post-bond inspection.
The high-speed and volumetric epoxy writing system provide for increased productivity of up to 8,000 UPH (actual cycle). Seven (7) standard patterns are installed with free pattern programmability. Multi-beam parallel processing supports wafer (die) recognition, multi-nozzle bonding and substrate recognition (pre- and postbond inspection).
Features & Benefits
Flexible for ultra thin die, Semi S2/S8 option
Near zero transport time for increased machine utilization
Wafer mapping software capability
High speed positive displacement dispensing
Accurate to +/- 25 microns, die size: 0.25mm to 25.4mm
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Model 522A is a Thermosonic Ball Bonder for wires from 0.7mil (18µm) to 2.0mil (50µm) in diameter featuring HYBOND’s exclusive Soft Touch TM force ramping system. Imitated but never duplicated, the Soft Touch™ system bonds effectively with less trauma to sensitive materials like GaAs and InP. Wire control is provided by a motorized feed system which features front panel adjustment for tail length and a swing away clamp assembly which makes threading wire easier. Front panel controls include independent 1st and 2nd bond dials for U/S, Time & Force as well as a built in work stage temperature controller. The 522A has a proven track record of safe and effective wire bonding worldwide.
Other Ball Bonder models available are the 522A with option 18 (OP-18) for deep access, 522A-40 for deep access and long reach and the 626 with motorized vertical movement and capability to wedge bond, peg bond and bump bond.
Please contact us at mailus@hybond.com for more detailed information.
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Bobbinless Coil Winder
Displayed : BHS-0155
NITTOKU offers various spindle and flyer type winding machines for bobbinless coils.
Models BLS-0135 and BHS-0155 are working with a newly developed controller for precise perfect layer winding! Automatic controls have been improved for consistent high quality production.
Features :
. Rigid traverse guide, making perfect layer winding possible without a slit groove wire guide
. Automatic adjustment to jig flange position
. BHS-0155 equipped with special software for even or uneven number of turns per layer winding
. BHS-0155 with NITTOKU`s unique intermittent wire feed mechanism
. BHS-0155 has jig synchronize with traverse to guide winding first layer
Optional :
. Pul-servo tensioner (recommended for stable high speed winding)
. Alcohol dispensing unit
. Nipper cutter to get required length at wire ends
. Unloading unit
. Unloading robot
. Other units as per requirements
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Pistol-Grip Attachment allows paste to be applied manually to copper and brass assembly
Compressed air from control panel is introduced to upper gun body, forcing circular piston and attached piston rod upward against coil spring. Pressurized paste alloy (from reservoir) fills vacant space between piston rod tip and nozzle orifice.
As timer de-energizes, compressed air is exhausted, and coil spring returns piston and rod to closed position. Piston rod tip displaces paste alloy through nozzle orifice and seals opening until next cycle. Precise deposit size is obtained by adjusting control panel timer, paste pressure, and length of piston rod stroke.
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Brushless Inslot Stator Winding Machine
(Nozzle Oscillation Type)
Displayed Machine : CIT-0150
The CIT-0150 is a newly developed coil winding machine especially for winding 3-phase brushless inslot motor. 3 Nozzles wind synchronously, allowing high productivity. High slot-fill factor and minimized noise make this machine a technological wonder.
Features :
. NC synchronized 3 Nozzle Winding
. Nozzle traverse, stroke change and core indexing servo-driven
. High slot fill
. High speed
. Vibration reduced. Minimized Sound
. High accuracy and durability
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Chip inductor coil winding machine
Displayed Machine : NCI-0150
The NCI-0150 and NCI-0250 machines are specialized machines for inductor coil winding. The machine is controlled by 12-axis and is capable to wind multiple inductor specifications. Cross-winding is possible for transponder coils. The type of welding is selectable.
Features :
. Shortened cycle time by core supply, winding, welding and core unload simultaneous processing
. Consumes little floor space
. Reduced weight
. Indexer operated by direct drive motor. No maintenance required.
. NITTOKU`s original auto tuning system stabilizes welding temperature
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Benchtop Operating System
BOS Series Spindle Coil winder
NITTOKU`s most sold model of winding machines!!!
The BOS series machines are high-performance, bench top coil winding machines equipped with servo motors. The cast-metal body is excellent in rigidity. Compact machine construction reduces the number of component parts and makes it easy for maintenance. The machine is capable of perfect layer winding.
Optionally BOS winders can be equipped with
. Direct Spindle drive
. Wire skeiner and Pulservo tensioner
. Nipper cutter
. Quick mount / disconnect type jig holder
for higher production, more accuracy, reduced running cost and less noise.
We have a variety of manufacturing lines utilizing BOS winders according to production specifications or wire specifications.
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Coil Winding Machine
Displayed Machine : KAI-0160
Nittoku offers a wide variety of coil winding machines. The range is from very small bobbinless coils or chip coils up to big motor coil winding machines. Front-end and back-end processes are also offered. NITTOKU is a manufacturer of complete coil winding systems and solutions!
The displayed KAI-0160 coil winding machine is an example of a very flexible inside-slot motor winding machine. The KAI series can not only wind, but also perform terminal wrapping. A single machine can be set up for a variety of specifications.
Features :
. AC servo motors
. NSC60 machine controller
. Quick and easy specification change-over
. Compact and simple mechanism
. 4 Axis NC control
. Perfect layer winding capable
. Tight winding possible
. NITTOKU`s original nozzle traverse mechanism included
. Can be included in manufacturing lines through our free-flow system.
Automation Options :
. Terminal inserting
. Soldering
. Testing
. Assembly
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This machine is used for winding tasks of transformer loops and is widely used in many transformer manufactures.
Feauters:Beautiful appearance and high load bear capacity
Stable starting speed and efficient break speed
Reliable operation and easy to control
Big torque force and low noise
Adjustable winding mould for optional choice.(maximum length:5000mm)
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Stand alone winders
MARSILLI winding machines are designed to produce wound components, suitable for any application.
Machine programmability, by means of the Personal Computer, offers the operator great versatility. The machine can be programmed to perform all movements allowed by its mechanical conformation.
The working cycle can be easily modified, stored and finally recalled, with absolute certainty of operation repeatability and positioning precision. The main features of MARSILLI’s machines are: programmability and flexibility of use.
Thanks to the quality level in organization, planning and implementation of its machines, MARSILLI received the international quality certification ISO9001.
MARSILLI’s machines are designed to work with absolute safety, and are certified as complying with the EC safety standards.
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The DiagnoSYS family of Conformal Coating Removal Workstations, the CCR1000 and CCR2000, are fully self-contained, non-chemical bench top workstations. They are designed for the removal of all conformal coatings applied to printed circuit boards and other electronic assemblies or devices.
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25 years of PV experience and 80 years of furnace production experience
ECM's industrial background and its passion for technological-sophisticated thermal applications naturally led ECM to develop monocrystal and polycrystal growth equipments.
Polycrystalline silicon ingot casting furnace
The process for obtaining a polycrystalline silicon ingot requires a high level of technical mastery. This sector, which is still young and is experiencing major growth, needs the support of all specialists at every stage of the wafers manufacturing process.
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LASER selective soldering station, tailored to the electronic production market, with specific solutions that are the result of long experience in LASER applications.
Reduced production costs and better quality results towards the traditional technologies.
Welding times reduced up to 0,5 sec/sport, thanks to the positioning dynamics assured by linear motors and the LASER technology
Reduction of the number of cold welding, through the instantaneous pre-heating of the two parts to be welded.
Optimal quality welding results using lead free alloys, thanks to the integrated pyrometer for continuous control of the process temperature.
Adaptable to different products, assured by the programmability of the jnput and tilt angles for the LASER bundle and the tin thread.
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Optomec's Aerosol Jet systems are offered in a number of standard configurations with optional features that can meet the most demanding user requirements. Engineering services are available to tailor hardware and software capabilities to address unique customer requirements. Optomec also provides onsite training, hotline support, preventative maintenance, and annual service programs.
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PCB Depaneling Desktop Robot JR2000NERT Series
Easy teaching and the router cutting method help you minimize defective items.
The router cutting method minimized stress on populated PCBs.
The double-check system, which consists of the position error detection function of the robot and the router bit sharpness checking function, minimizes defective items.
Hassle-free, step-by-step interactive teaching.
Teaching can be done simply by entering the preset items.
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The OAI Model 2000 may be configured as either an edge-bead exposure tool or a flood exposure system; both configurations are based on a proven, time-tested platform.
The OAI 2000SM Edge-bead Exposure System provides a cost-effective method for edge-bead removal using standard shadow mask technology. Mask and substrate changeover can be accomplished quickly and easily adding to the versatility as well as throughput of this high volume production tool.
The Model 2000 systems include a UV lightsource, intensity controlling power supply and robotic substrate handling subsystem. UV lightsources provide adjustable intensity beams with divergence half-angles of <2.0%. Power supplies are available from 200W to 2,000W. Intensity controller sensors are linked directly to the lightsource for accurate intensity monitoring. The OAI robotic substrate handling system is microprocessor controlled and may be programmed to accommodate a wide variety of substrate sizes. The shadow mask capability enables the user to pattern the top-side of a substrate while being held in very close proximity to the mask. At a separation of 25 microns, these systems are capable of 6 micron resolution.
2000FL Flood Exposure Systems are used to augment and/or enhance the photolithography processes in both production and R&D settings. Applications include photoresist stabilization and modification, image reversal and PCM processes.
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HYBOND’s Model EDB-140A is a semiautomatic epoxy/silver glass die bonder which provides uniform epoxy or silver glass dispensing with consistent material thickness and precise die placement. The EDB-140A can be fitted with a waffle pack/jel pack or loose die pedestal or a die ejector for holding die on wafers. The dispense system can be fitted with Hybond’s micro-dispense head for extremely low volume epoxy dispensing. This die bonder is rugged enough for continuous production and ideal for small production runs and laboratory applications. Die pick up and placement are made easy with the aid of dual CCTV cameras and a split screen monitor which incorporates a die and package visual targeting system. The EDB-140A is modular and easily adapts to modifications to accommodate fixturing for custom packages.
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Bondjet BJ820
The Bondjet BJ820 is the latest development of Hesse & Knipps' wedge bonding innovation, handling all challenging wire bonding applications on a single platform - RF and microwave devices, COB, MCM and hybrids, fiberoptics and automotive using aluminium or gold wire or ribbon.
High Speed Fine Pitch Wedge Bonder
Precision:
- 1 μm at 3 σ axis repeatibility at an interpolated encoder resolution of 20 nm
Largest Bonding Area
- 305 mm x 410 mm (12'' x 16,1'') work area can serve as two or mor smaller stations for efficient handling of smaller products or substrates, eliminating index time and maximizing throughput
- Enables intelligent automation of extra large products
Speed:
- Up to 7 wires per second
Quality:
- Consistant performance for the highest yields
- Realtime bond quality monitoring system
- Wear- and maintenance free piezo bondhead with solid state hinges
- Software supports control by host computer, product traceability and external statistical analysis
Small footprint, big capability:
- Integrates easily into complex production lines
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The FC300 High Force Device Bonder is a new generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding on wafer up to 300 mm.
It includes Nanoimprinting Lithography (NIL) capabilities.
The FC300 is a configurable platform which can perform various applications with a quick and easy process head exchange:
high force bonding, especially interesting for Cu-Cu bonding applicable to 3D-ICs packaging or Nanoimprint using Hot Embossing Lithography,
low force for reflow bonding of RF & optoelectronics devices assembly,
UV-curing for adhesive bonding or for Nanoimprint using the UV-NIL process.
High End Processes
Die bonding, flip chip bonding, mass reflow, in-situ reflow, fluxless eutectic bonding, thermocompression bonding, ultrasonic bonding, UV-curing bonding, adhesive bonding,
UV-NIL, hot embossing lithography...
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For High Precision Cost-Sensitive Applications All in one process for mounting and bonding High Speed and Accuracy Mounting
Speed: 0.8 sec/IC Chip Component Accuracy: +/- 8µmt Small Footprint: 1.7 Square Meters Easy Operation with Color Touch Screen Inspection of Known Good Die from wafer Capable to handle FR4, Ceramic or Silicon
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Machines for electronics production
