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Memory size: 12 GB
... SMARC® 2.1.1 module with Qualcomm® QCS5430 processor Cpu 2x Arm® Cortex®-A78 @2.4 GHz, 4x Arm® Cortex®-A55 Memory Soldered-down LPDDR5-6400 memory, up to 12GB total, 32-bit interface 2 channels Graphics Qualcomm® Adreno™ 642L Video Interfaces LVDS ...
SECO
Memory size: 0 GB - 32 GB
... Overview
SMARC® Rel. 2.1.1 module for edge and embedded applications equipped with Qualcomm® Dragonwing™ IQ8 application processors. Designed for integration on a SMARC carrier board for industrial and commercial use.
Highlights
- CPU
SECO
Memory size: 0 GB - 64 GB
... Overview
COM-HPC® Size A Client Module SOM-COM-HPC-A-ARL designed for Intel® Core™ Ultra Processors (Series 2, Arrow Lake H and U). Modular board in COM-HPC Size A form factor (120 x 95 mm) for industrial edge, automation, vision systems and ...
SECO
Memory size: 0 GB - 16 GB
... Overview
COM Express® Rel. 3.1 Type 6 computer-on-module SOM-COMe-CT6-TWL featuring Intel® Core™ i3 and Intel® Processors N Series (codename: Twin Lake). Compact 95 x 95 mm form factor designed for embedded and industrial systems.
Highlights
- CPU:
SECO
Memory size: 0 GB - 64 GB
... Overview
COM Express 3.1 Type 6 Compact module integrating Qualcomm Dragonwing IQ‑X Series processors in SiP‑A, featuring a Qualcomm Hexagon NPU up to 45 TOPS. Designed for embedded and edge AI applications requiring high CPU/GPU performance ...
SECO
Memory size: 0 GB - 96 GB
... Overview
COM Express® 3.1 Type 6 Compact Module SOM-COMe-CT6-P100 featuring AMD Ryzen™ AI Embedded P100 Series processors. Compact 95 x 95 mm module designed for embedded applications requiring AI acceleration, multimedia and extensive I/O options.
Highlights
- CPU
SECO
Memory size: 0 GB - 96 GB
... Overview
COM Express Rel. 3.1 Type 6 module featuring Intel® Core™ Ultra Series 3 processors (codename: Panther Lake-H), designed for high-performance embedded and edge systems requiring AI acceleration, multi-display support and extensive I/O.
Highlights
- CPU:
SECO
Memory size: 0 GB - 64 GB
... Overview
COM Express Revision 3.1 Type 6 Basic module (E59) compatible with Intel® Core™ Ultra Processors Series 2 (codename Arrow Lake, H- and U-SKUs). Designed for embedded and edge systems requiring configurable CPU, advanced graphics and ...
SECO
Memory size: 2 GB - 8 GB
Unleash the full potential of the NXP i.MX8M Plus, featuring ARM® Cortex®-A53 processor and Neural Processing Unit (NPU). This empowers Artificial Intelligence (AI) and Machine Learning (ML) capabilities, enhances multimedia performance, supports cutting-edge ...
Memory size: 1, 2, 4 GB
... Low-cost AM62x processors with extensive peripherals, dual-display support and 3D GPU, ideal for industrial applications The AM62x represents TI's latest high-performance, ultra-efficient processor for industrial automation applications. The processors ...
MYIR Electronics Limited
Memory size: 1, 2, 4 GB
The Renesas RZ/G2L processor is equipped with [email protected] CPU, Cortex-M33@200MHz, Arm Mali-G31 3D graphics acceleration engine and video codec support. It is equipped with 16-bit DDR4-1600/DDR3L-1333 dynamic random access memory, camera interface ...
MYIR Electronics Limited
Memory size: 512 MB
The XC7A100T-2FGG484I is an FPGA chip from the Artix-7 series, known for its cost-effectiveness, low power consumption, and high performance. It offers abundant programmable resources, including 100K logic cells, 35K FPGA storage units, and 120 I/O pins, ...
MYIR Electronics Limited
... Product overview
The AI SoC Module (Model 291940090) is a compact edge computing module designed for efficient on-device AI inference and real-time video processing. It targets integrators and OEMs building security, industrial automation and ...
Memory size: 2 GB - 8 GB
... Product overview
The Edge AI SoM computing module delivers scalable AI acceleration and multimedia processing for security, industrial automation and smart IoT at the edge. Built for real-time video analytics, predictive maintenance and autonomous ...
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