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... Substrate-Like PCB. SLP is called the "next generation of PCB". The L/S of SLP can be as low as 20/35um, compared to 40/50um of HDI. SLP is closer to IC substrate used for semiconductor packaging in manufacturing process. The ...
... Customized ceramic substrates from INNOVACERA serve as foundational materials for power electronics, semiconductor packaging and microelectronics, providing mechanical support, electrical ...
... Technology: Local Power Generation, Electric Vehicle, Traction Control System, Photovoltaic Units, Wind Power - Industrial: LED Displays, Welding Machine - Aerospace: Laser, Power Supply ...
... cost. Direct Plated Copper Substrate Applications: – High Power LED Packaging – Hybrid and electric automobile power management electronics – RF microwave communication – ...
... 0,3mm copper bonded on both sides with Optional Nickel plating DCB thermal expansion matches silicon Optimized for use in power hybrids Excellent Mechanical Strength, Stable Shape with Good Adhesion & Corrosion Resistance Good Thermal ...
... ); when chemical treatment of substrate surface is required; for substances whose thickness does not exceed 30 nm ** Stability + — substrates allow treatment in different chemical environments. Stability – — substrates ...
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