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Memory size: 0 GB - 96 GB
... DDR5 6400MHz Dual-Channel SODIMM x 2, up to 96GB - VGA Switch DDI x 1, LVDS colay eDP x 1, DDI x 2 - USB 2.0 x 8, USB 3.2 Gen 2 x 4 - PCIe [x1] x 4, PCIe [x4] x 1, PEG [x8] + [x4] + [x4] - Intel® Ethernet Controller I226, 2.5GbE x 1 - 9V ~ 16V Power Input - ...
AAEON
Memory size: 0 GB - 64 GB
... COM Express Type 6 Compact Size with 11th Gen Intel® Core™/Celeron® Processors - DDR4 3200MHz SODIMM x 2, up to 64GB - VGA x 1, LVDS x 1, DDI x 3 - USB 2.0 x 8, USB 3.2 Gen2 x 4 - PCIe [x1] x 5, PEG [x4] x1 - Intel® Ethernet Controller I226 2.5GbE x 1 - ...
AAEON
... Overview COM Express Compact Type 6 with 11th Generation Intel® Core™ Processor Family (formerly Tiger Lake UP3) Features -11th Generation Intel® Core™ Tiger Lake-UP3 SoC Processor -2 x SODIMM DDR4 3200MHz Memory, up to 64GB (in-band ECC) -Intel I225LM ...
AAEON
Memory size: 0 GB - 64 GB
... COM Express® 3.1 Type 6 Basic Computer on Module (CoM) with 13th Gen Intel® Core™ processors (formerly codenamed Raptor Lake-P) Graphics Intel® UHD Graphics/Intel® Iris® Xe Graphics architecture, up to 96 EU Improved image (IPU6EP) and video processing ...
SECO
Memory size: 0 GB - 64 GB
SOM-COMe-BT6-CFL-H is a COM Express® Basic Type 6 Computer on Module (CoM) with Intel® 8th generation Core™/ Xeon® (formerly Coffee Lake H) and 9th generation Core™ / Xeon® / Celeron® (formerly Coffee Lake Refresh) CPUs reaching a maximum of 12 threads. ...
SECO
Memory size: 0 GB - 64 GB
... COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 11th Gen Intel® Core™ (formerly Tiger Lake UP3) Processors Graphics Intel® Iris® Xe Graphics, up to 96 Execution Units Up to 4 independent displays supported Support DirectX 12, OpenGL ...
SECO
Memory size: 0 GB - 96 GB
... The TGH960 is a COM Express® Basic (Type 6) system-on-module from DFI designed for industrial applications that require high I/O density, multiple expansion lanes and long CPU lifecycle support.
Highlights
- COM Express® Basic (Type
DFI
Memory size: 32 GB
... Dual channel DDR4 2400/3200MHz SODIMM up to 32GB Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI (* Default)；Supports up to four independent displays DP++ resolution supports up to 4096x2304 @ 60Hz Multiple expansion: 1 PCIe x8, 7 PCIe x1 Rich I/O: 1 ...
DFI
Memory size: 16 GB
... 7th Gen Intel® Core™ Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0 Multiple expansion: 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus Three independent displays: VGA*/DDI + LVDS*/eDP + DDI Dual channel DDR4 2133MHz memory down up to 16GB 15-Year CPU Life Cycle Support ...
DFI
Memory size: 64 GB
... Intel Alder Lake COM-E core module Support 2 x SATA3.0 Support 4x display output, 3 x DD1 for HDMI/DP, 1 x DD1 for VGA Dimension: 95*95*2.0mm ...
Memory size: 64 GB
... Supports Intel 11th Generation Core U-series processors, standard with i5-1135G7 Supports five display outputs: 1x DDI, configurable as VGA 1x EDP to LVDS, configurable as ED Dual-channel DDR4 memory design, supports ...
ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores ...
ADLINK TECHNOLOGY
... Features The Intel® ATOM™ N270 and 945GSE platform that provides cost effective solution and technology The Intel® platform brings under 10W TDP solution for easy fan-less design SATA and IDE interface provide best cost effective functions ...
PORTWELL
Memory size: 0 GB - 32 GB
... 1 x Intel® I226LM/IT Intel® HD Audio Integrated on CPU Onboard nuvoTon_NPCT754AADYX TPM 2.0 DC in +9V ~ +19V System Information I/O Chipset EC iTE IT5782 Watchdog Timer H/W Reset, 1Sec. ~ 65535Sec. and ...
The VIA ETX-8X90 is a highly-integrated embedded multimedia module with native ISA/PCI support for legacy expansion cards and applications. Powered by a 1.2GHz VIA Nano® X2 E-Series dual core processor and VIA VX900 MSP, the VIA ETX-8X90 offers industry-leading ...
Memory size: 32, 64 GB
... Chipset - MCP BIOS - AMI SPI 256 Mbit Form Factor Dimensions - COM Express Compact Type 6 (3.74-in x 3.74-in x 0.52-in, 9.5 cm x 9.5 cm x 1.3 cm) Memory Socket - 2 x 260-pin SO-DIMM Graphics Controller - Intel® Iris® Xe Graphics Max resolution ...
ASRock Industrial
... Product model：WAR-VGA-SN10 size：7 inch CPU: Cortex-A9 architecture, frequency 1.4GHZ Memory: 1GB DDR3 EMMC：8GB Basic parameters CPU：Quad-core Cortex®-A9 ，frequency 1.4GHz Memory：1GB DDR3 Flash：8GB NandFlash Hardware ...
... EDM-IMX7 is an ARM Cortex-A7 + M4 NXP i.MX7 based, scalable single/dual core EDM Type 1 compact System on Module. Dual Gigabit LAN, Wi-Fi 802.11 a/b/g/n/ac and Bluetooth 5 communication interface. Targeting multimedia applications with LVDS, TTL, S/PDIF, ...
... The ConnectCore 6 is an ultra-compact and highly integrated system-on-module solution based on the NXP/Freescale i.MX6 Cortex-A9 processor family. With processor speeds up to 1.2 GHz and fully pin-compatible single-/dual-/quad-core variants, the ConnectCore ...
... Memory - DDR3-1333, 1/2/4GB, on board Storage - 1*eMMC 8/16/32G, 1*TF Card Expansion Interface - 1*Mini-PCIe (3G supported) OS - Android, Linux I/O Interface Ethernet 1*Realtek® 1Gbps PCIe Ethernet Controller (PHY), RJ45 1*Realtek® ...
... ST002- carrier board •Flexible interface for verification •Expedite customer's evaluation board development •Interface: 1 x VGA, 1 x HDMI or DP, 4 x mini PCIe, 3 x SIM holder, 2 x USB 3.0, 2 x USB 2.0, 4 x COM, 2 x GbE, Line-out, Mic-in ...
... COM Express Type 6 Compact module based on 12th Gen Intel® Core™ embedded mobile processors (code name "Alder Lake") Intel® hybrid design combines Performance-cores with Efficient–cores Up to Intel® Iris® XeGraphics® architecture with up to 96 EUs PCI ...
Congatec
... Neptune: EPIC format CPU with integrated autocalibrating analog I/O, digital I/O and DC/DC power supply Neptune introduces a new concept in small form factor embedded SBCs. The CPU core consists of an ETX module which mounts on the bottom side of ...
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