Shock test stand MS series
automaticfor materialsfor electronic components

Shock test stand - MS series - AI SI LI (China) Test Equipment Co., Ltd - automatic / for materials / for electronic components
Shock test stand - MS series - AI SI LI (China) Test Equipment Co., Ltd - automatic / for materials / for electronic components
Shock test stand - MS series - AI SI LI (China) Test Equipment Co., Ltd - automatic / for materials / for electronic components - image - 2
Shock test stand - MS series - AI SI LI (China) Test Equipment Co., Ltd - automatic / for materials / for electronic components - image - 3
Shock test stand - MS series - AI SI LI (China) Test Equipment Co., Ltd - automatic / for materials / for electronic components - image - 4
Shock test stand - MS series - AI SI LI (China) Test Equipment Co., Ltd - automatic / for materials / for electronic components - image - 5
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Characteristics

Test type
shock
Operating mode
automatic
Test material
for materials, for electronic components
Sector
for the automotive industry
Technology
mechanical

Description

MIL-STD-810F Standard Mechanical Shock Bump Tester is intended to simulate the effects of repetitive shocks likely to be experienced by components when they are transported in a vehicle from one place to another place or installed for its application on a moving vehicle or platform. The tests can be performed in accordance with worldwide standards such as IS, BS, MIL, DIN, EN, ISO, IEC, DEF & ASTM. MIL-STD-810F Standard Mechanical Shock Bump Tester is mainly used for small products for impact test, to assess the product's ability to withstand shock damage. It is often used in electronic components, electronic circuit boards And other Environmental testing. Mechanical Shock Testing Machine Shock and measure controller MIL-STD-810F Standard Mechanical Shock Bump Tester Features: 1. Working bench with perfect structure, good uniformity of the bench's acceleration. 2. Highly reliable system, safety device. 3. The saw-tooth wave and trapezoidal wave, etc. Extensible. 4. Capacity of crash and impact test function. 5. Optoelectronic feedback.

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