EDGE PC TANK-870-Q170 series

boxembeddedIntel® Core i5

Overview

• Fanless rugged industrial embedded system platform based on 6th/7th Gen Intel® Core™ processors with Intel® Q170 chipset and DDR4 memory support.
• Triple independent display capability and abundant high-speed I/O concentrated on one side for simplified installation.
• On-board internal power connector to supply add-on cards and flexible backplane options (2-slot and 4-slot variants).
• AWS IoT Greengrass Qualified for edge deployments.

Key features

• Rugged fanless chassis available in 2-slot and 4-slot configurations for industrial automation and edge computing.
• Multiple expansion options: PCIe x16 / PCIe x8 / PCI and PCIe Mini (half/full-size) depending on model.
• Wide DC input range 9 V–36 V (DC jack or terminal block) and internal 5V@3A or 12V@3A connector for add-on power.
• Compliance for shock, vibration and EMC (MIL-STD vibration with SSD, CE/FCC).

Form factor / Hardware summary
Form factor: SBC form factor
CPU options: Intel® Core™ i7-6700TE (2.4 GHz, quad-core, TDP 35W) or Intel® Core™ i5-6500TE (2.3 GHz, quad-core, TDP 35W)
Chipset: Intel® Q170
Memory: 2 x 260-pin DDR4 SO-DIMM (one 4GB pre-installed, up to 32GB)
Power example: 19 V @ 3.68 A (i7-6700TE with 8GB)
Reliability: Operating shock 5G half-sine, MIL-STD-810G vibration (with SSD), CE / FCC certified


I/O & Connectivity

• USB: 4 x USB 3.0, 4 x USB 2.0
• Ethernet: 2 x RJ-45 (Intel® I210 and Intel® I219LM)
• Serial/COM: 4 x RS-232 (2 x RJ-45, 2 x DB-9 isolated), 2 x RS-232/422/485 (DB-9)
• Digital I/O: 8-bit (4-in / 4-out)
• Display: VGA, HDMI/DP (supporting up to 4K where applicable), optional iDP
• Audio: Line-out, Mic-in

Expansion

• PCIe Mini: 1 x half-size and 1 x full-size (mSATA support depending on configuration)
• Backplane / expansion (by model): 2-slot: 1 x PCIe x16 + 1 x PCI or 2 x PCIe x8; 4-slot: 2 x PCIe x8, 2 x PCI, 1 x full-size PCIe Mini

System & Storage
Cooling: Fanless
Drive bays: 2 x 2.5" SATA 6Gb/s HDD/SSD (RAID 0/1 support)


Physical & Environmental
Construction: Extruded aluminum alloy chassis
Color: Black C + Silver
Dimensions: 2-slot: 121.5 x 255.2 x 205 mm; 4-slot: 154.8 x 255.2 x 205 mm
Operating temperature: i7: -20°C ~ 45°C (with airflow); i5: -20°C ~ 60°C (with airflow)
Humidity: 10% ~ 95% non-condensing


Package contents

• 1 x Chassis screw
• 1 x Mounting bracket

Technical specifications

• Model: TANK-870-Q170
• Supported CPUs: Intel® Core™ i7-6700TE, Intel® Core™ i5-6500TE
• Chipset: Intel® Q170
• Memory: 2 x DDR4 SO-DIMM, up to 32GB (1 x 4GB pre-installed)
• Storage: 2 x 2.5" SATA bays (RAID 0/1)
• I/O: USB 3.0 x4, USB 2.0 x4, 2 x Gigabit LAN, multiple COM ports, 8-bit digital I/O
• Expansion: PCIe/PCI backplane options (2-slot / 4-slot)
• Certifications: CE / FCC